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Micromechanical component with antistick layer

A non-stick layer and micro-mechanical technology, applied to micro-mechanical components, is a field that can solve problems such as increased system failure risk, failure, and adhesion, and achieves the effects of simple cost, improved temperature budget, and cost savings

Inactive Publication Date: 2009-09-09
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can lead to an increased possibility of sticking during operation and thus to an increased risk of system failure
Another disadvantage of the known SAM layer is that it is not possible to carry out anodic processes (eg anodic bonding) on ​​the coated surface (and without expensive pre-processing such as laser ablation)

Method used

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  • Micromechanical component with antistick layer
  • Micromechanical component with antistick layer
  • Micromechanical component with antistick layer

Examples

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Embodiment Construction

[0015] exist figure 1 shows a schematic cross-section through a micromechanical component 10 according to the invention according to a first embodiment of the invention, and in image 3 A schematic sectional view through a micromechanical component 10 according to the invention according to a second embodiment of the invention is shown in .

[0016] In both embodiments, the component 10 comprises a base 11 , a cover 30 and a micromechanical functional element 12 which is arranged movably relative to the base 11 and the cover 30 . The micromechanical component 10 according to the invention relates in particular to an inertial sensor, such as a (linear) acceleration sensor, a rotational ratio sensor or to another micromechanical component with an at least partially movable structure. components, such as a micromechanical microphone. According to the invention, the functional element 12 is in particular a mass element of an inertial sensor or again a microphone diaphragm or the...

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Abstract

A micromechanical component with a substrate and a functional element is proposed, wherein the functional element has a functional surface with an antistick layer applied at least in regions and serving for reducing surface adhesive forces, wherein the antistick layer is furthermore stable with respect to a temperature of above 800 DEG C.

Description

Background technique [0001] The invention relates to a micromechanical component and a method for producing a micromechanical component having the features of the preambles of the accompanying claims. [0002] Movable elements in micromechanical structures or micromechanical structures and components (so-called MEMS components) can be glued or adhered to fixed structures. In addition, mechanical overloading or electrostatic charging is taken into account as means for the release of the glue or adhesion. A problematic mostly because irreversible adhesion is first obtained by chemical linkages, such as van der Waals interactions, ionic interactions, common valence linkages or metallic linkages. Surfaces in contact with high surface energies - such as silicon surfaces with or without layers made of OH groups or with or without water films or also hydrogen-interrupted silicon surfaces - may show strong connections force, then this involves, for example, ionic interactions or com...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
CPCB81C2203/031B81B3/0005B81C2201/112B81C2203/0109B81C1/0096
Inventor F·拉尔默S·克龙米勒T·富克斯
Owner ROBERT BOSCH GMBH