Reflective and radiating base of high-power LED light source

Abstract

A reflective and radiating base of a high-power LED light source comprises a substrate, a fixed frame, a reflective cup and a led chip and is characterized in that the substrate is a rectangular or round metal plate. The substrate is provided with a substrate spacing hole and at least three locating holes, wherein the substrate spacing hole is used for restricting the positive and negative plugs of a power source. The fixed frame is used for location and installation by inserting a polarized plug into the locating hole corresponding to the polarized plug. The fixed frame takes the shape of a hoop which is provided with a hollow part which exposes partial top surface of the substrate. The fixed frame is provided with a conductive contact pin through hole provided with a projection towards the exposed top surface of the substrate. The reflective cup is provided with a reflective cup through hole corresponding to the projection and is embedded on the projection so as to locate and install the reflective cup by using the projection. The inner surface of the reflective cup has high reflecting rate. The led chip is bonded on the inner bottom surface of the reflective cup. The reflectiveand radiating base has the advantages of reducing the use of fixed components and saving substantial cost by using the locating holes, the polarized plug, the projection and the reflective cup through hole.

Description

technical field [0001] The invention relates to a light-reflecting and heat-dissipating base of a high-power light-emitting diode (LED). The base has the characteristics of high light reflection rate, outstanding heat dissipation effect, beautiful appearance, and easy installation of lighting fixtures with LED light sources. The base can greatly prolong the service life of light-emitting diodes (LEDs) and reduce power consumption. Background technique [0002] In recent years, the energy problem has become the most important issue that plagues the economic development of all countries in the world. The old lighting fixtures such as incandescent lamps and fluorescent lamps with high energy consumption and low luminous efficiency can no longer meet the new needs of lighting fixtures in today's society. Therefore, the LED light source with the characteristics of low energy consumption and long life is gradually favored by the market and has become the most popular lighting appl...

AI Technical Summary

Problems solved by technology

[0008] ① Only part of the light emitted by the led chip 15 is emitted from the top surface and reaches the outside world, becoming the light used for lighting as we see it, but a large part of the light is emitted from the side and bottom surface, and this part will not be emitted to the outside world. the outside world, so cannot be a light for lighting

[0011] From the above analysis, we can see that due to the unreasonable setting of the traditional base structure, most of the light emitted by the LED chip 15 cannot be reflected to the outside to form light for lighting, but is consumed inside the base , converted into heat energy

As we all know, LED chips will generate a lot of heat during operation. In a small space, if a large amount of heat cannot be dissipated in time, it will reduce the light conversion rate and brightness of the LED chip, and it will also have an extremely serious impact on Service life of led chip 15

In this case, coupled with the heat energy converted from the light emitted from the bottom and sides of the LED chip 15 due to the traditional base structure of this LED light source, this situation will be seriously aggravated, further reducing the light conversion rate Decrease, brightness reduction, and the service life of led chips

[0012] ②Ceramics are used in the traditional base structure of this LED light source. Ceramics can still have high electrical insulation properties at higher temperatures, but the processing difficulty of ceramics is much higher than that of other insulating materials, so it brings processing problems. The cost increases sharply, and at the same time, the processing of ceramics is completed at high temperature, which puts forward higher requirements on the high temperature resistance of the base structure as a whole, further increasing the manufacturing cost

[0013] ③In the processing process of the traditional base structure of this kind of LED light source, since the identification and positioning mechanism must be passed between the layers, it can be installed, so it is necessary to add a special positioning mechanism, and then these positioning mechanisms are used in the subsequent process. It is removed, which not only increases the process flow, resulting in an increase in production costs, but also because the positioning mechanism is removed, it brings additional material, which further increases the production cost

It not only increases the two production steps of forming the positioning mechanism and removing the positioning mechanism, but also causes a lot of waste of raw material copper for forming the positioning mechanism, which greatly increases the production cost

[0014] ④ When the base 11 with the led chip 15 is connected to the external circuit, welding wires are often used on the internal connection layer 12, and then directly electrically connected, and this connection will make some wires connected to the positive and negative poles of the led chip be connected to each other. It is exposed to the air when the distance is very close, and it is very easy to cause a short circuit between the positive and negative electrodes in the outdoor environment

Moreover, parasitic capacitance is easily generated on the positive and negative wires, which reduces the performance of the LED light source.

And common welding method also can be because led chip 15 is too tiny, is unfavorable for the operation of welding, also can make a large amount of charges in the welding process accumulate in the vicinity of led chip 15, easily cause the breakdown damage of led chip 15, make finished product a drastic reduction in the rate

[0015] 5. Since the positive and negative wires connected to the led chip 15 are connected from the internal connection layer 12, some wires are directly passed out from the side or bottom surface of the base, which is unattractive and inconvenient to have the base of the led chip 15. Installation of seat 11 on lamps

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