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LED lamp strip and manufacturing method as well as LED screen body

A technology of LED strips and substrates, which is applied to LED screens. It can solve problems such as difficulty in making small-sized LEDs, limiting the minimum size of LEDs, and inability to meet customer size needs.

Inactive Publication Date: 2015-04-29
广州欧灯电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, LED light-emitting diodes are basically elliptical or piranha-shaped according to a fixed size, which cannot meet the size requirements of customers arbitrarily set, nor can they meet the requirements of customers' special patterns; it is difficult to make small Dimensions of LED
[0004] In addition, in the prior art, the technology of placing the LED in a cup-shaped submount and encapsulating it with a light conversion material will limit the minimum size of the LED, especially the minimum size of the white LED

Method used

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  • LED lamp strip and manufacturing method as well as LED screen body
  • LED lamp strip and manufacturing method as well as LED screen body
  • LED lamp strip and manufacturing method as well as LED screen body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] An LED light bar comprises at least one substrate, at least two grooves arranged on the substrate, at least two LED light emitting diodes, at least one control chip, and at least one set of connecting wires. Wherein, a set of connecting wires includes at least one positive wire, at least one negative wire, and at least one signal wire, which are respectively connected to external power and signal sources.

[0028] For example, if figure 1 As shown, an LED light bar includes a substrate 101, a groove 102A, a groove 102B and a groove 102C are arranged on the substrate 101, and three LED light emitting diodes, namely LED light emitting diode 130, LED light emitting diode 131 and The LED light emitting diodes 132 are respectively arranged in corresponding grooves.

[0029] A control chip is arranged on the substrate 101, and the control chip includes a positive terminal, a negative terminal, a signal input terminal and at least one control signal output terminal; or, on th...

Embodiment 2

[0067] Such as figure 2 As shown, this embodiment provides a LED light-emitting diode, including an LED die, the LED die is a wafer composed of a p-type semiconductor 103 and an n-type semiconductor 106, a substrate 101, and a groove arranged on the substrate 102. Filler, a control chip, and a positive pin and a negative pin.

[0068] The LED die and the control chip are arranged in the groove 102, the filler is arranged on the outer surface of the light-emitting surface of the LED die, and is bonded and arranged in the groove 102, and placed in the groove 102. A shell is formed between the grooves 102, and the LED dies are respectively connected to the positive pin and the negative pin for connecting to the control output end of the external driving circuit. For example, the shell may be one of a convex shell, a concave shell or a flat shell.

[0069] For example, in the groove 102, the filler in this embodiment is phosphor powder, and a shell 105A is formed between the ph...

Embodiment 3

[0076] Such as image 3 As shown, this embodiment provides a LED light-emitting diode, including an LED die, the LED die is a wafer composed of a p-type semiconductor 103 and an n-type semiconductor 106, a substrate 101, and a groove arranged on the substrate 102, filler, and power supply positive and negative wires;

[0077] The filler is arranged in the groove 102, the filler in this embodiment is a phosphor powder mixture, the phosphor powder forms a package 105A between the grooves 102, and the LED die It is arranged in the middle of the package body 105A, and the package body 105A is a 105A package body formed by integrally setting the convex shell and the LED die through the filler.

[0078] In order to better match the luminous effect of LED light-emitting diodes, cadmium selenide nanocrystallites are also set in the filler, and the cadmium selenide nanocrystallites are mixed in the filler according to a preset ratio to control the luminous wavelength. . A cadmium se...

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Abstract

The invention discloses an LED lamp strip and a manufacturing method as well as an LED screen body. The LED lamp strip comprises at least one base plate, at least two grooves, at least two LEDs, at least one control chip and at least one group of connecting wires; the LED light-emitting diode comprises an LED tube core and filler; the LED tube core is arranged in the groove; the filler is positioned in the light-emitting direction of the LED tube core, is fixedly arranged above the groove and is arranged as a tube shell of the LED light-emitting diode; the tube shell and the LED tube core are combined tightly by the filler; and the control chip is used for receiving and controlling signals and sending the signals to the LED light-emitting tube. Therefore, the invention can lead the LED to be smaller and easier to manufacture, thus manufacturing smaller LED lamp strip and lighter and thinner LED screen.

Description

technical field [0001] The invention relates to a lighting device, in particular to an LED light bar and an LED screen. Background technique [0002] LED is the abbreviation of English light emitting diode (light emitting diode). Its basic structure is a piece of electroluminescent semiconductor material, which is placed on a shelf with leads, and then sealed with epoxy resin around it to protect the inner core wire. effect. The core part of a light-emitting diode is a wafer composed of a p-type semiconductor and an n-type semiconductor, and there is a transition layer between the p-type semiconductor and the n-type semiconductor, which is called a p-n junction. In the PN junction of some semiconductor materials, when the injected minority carriers recombine with the majority carriers, the excess energy will be released in the form of light, thereby directly converting electrical energy into light energy. [0003] In the prior art, LED light-emitting diodes are basically e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S4/00F21V21/00F21V23/00F21V23/06F21V19/00H05B37/02G09F9/33F21Y101/02F21S4/20F21Y115/10
Inventor 商松
Owner 广州欧灯电子科技有限公司