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A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate

A technology of heat pipe radiator and positioning structure, which is applied to semiconductor devices, semiconductor/solid-state device components, electrical components, etc., can solve the problem of large contact thermal resistance, and achieve the reduction of substrate size, contact thermal resistance, and size reduction. Effect

Active Publication Date: 2009-09-30
ZHUZHOU CSR TIMES ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of large contact thermal resistance caused by the press-fit positioning method of the existing high-power components and the heat pipe radiator, and to provide an improved press-fit positioning of the semiconductor element and the heat pipe radiator substrate The structure can significantly reduce the contact thermal resistance, and best meet the heat dissipation requirements of high-power semiconductor components on locomotive rectifiers

Method used

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  • A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate
  • A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate
  • A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate

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Embodiment Construction

[0016] figure 2 , image 3 A schematic diagram of the structure of an embodiment of the present invention is given, which can be applied to rectification devices of domestic Shaoshan series electric locomotives and diesel locomotives.

[0017] The press-fit positioning structure mainly consists of the heat pipe radiator substrate 2, the 3-5 inch silicon rectifier element 1 located between the substrates 2, the external conductive connecting plate 3 fixed on the substrate 2, and the fastening mechanism for fastening the substrate 2 and the semiconductor element 1. The elastic press-fit assembly consists of a fastening screw 4, a fastening nut 10, a spring plate 5, a disc spring 6, a steel ball 7, an insulator 8, and a positioning pin 11. The elastic press-fit assembly is arranged on the rectifier The supporting part 9 on the top is fixed and positioned, and the heat pipe radiator base plate 2 is located in the area formed between the elastically pressed fastening screws 4. Th...

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Abstract

The present invention discloses a modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate, wherein it consists of heat pipe radiator base plate, semiconductor element, external conducting connection plate fixed onto the base plate, and elastic press mounting module that fastens base plate and semiconductor element; the elastic press mounting module is fixed onto the rectifying device through the support component on it; the heat pipe radiator base plate is located in the space formed by the fastening screws in the elastic press mounting component; on the heat pipe radiator base plate, a positioning component is provided to match the center hole of the semiconductor element, and on the external conducting connection plate, there is at least one through hole for fastening screw. This structure may significantly reduce the dimensions of the heat pipe radiator base plate. Thereby copper with great thermal conductivity may be adopted, no static friction will be generated between the screw and the base plate, and pressure can be completely transferred to the contact surface, thus remarkably reducing thermal contact resistance.

Description

technical field [0001] The invention belongs to the heat dissipation technology of a power device of a locomotive rectifier, and in particular relates to an improved press-fit positioning structure of a semiconductor element and a heat pipe radiator substrate. Background technique [0002] Semiconductor components are used as switching devices in high-power rectifiers for locomotives. In order to reduce the number of parallel components of a single bridge arm, large components tend to be used. For example, the rectifier for electric locomotives uses six 2-inch thyristors in series and parallel for one bridge arm. , Up to now, only one 5-inch thyristor is used for one bridge arm, and the heating power consumption of a single semiconductor element reaches several thousand watts. Therefore, the supporting heat sink is required to have a higher heat dissipation capacity, and at the same time, the contact thermal resistance between the semiconductor element and the heat sink must...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/40H01L23/427H01L23/13
Inventor 付国书徐达清李彦涌刘旭君李华伟范斌王群山沈希军
Owner ZHUZHOU CSR TIMES ELECTRIC CO LTD
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