A modified structure for press mounting and positioning of semiconductor element and heat pipe radiator base plate
A technology of heat pipe radiator and positioning structure, which is applied to semiconductor devices, semiconductor/solid-state device components, electrical components, etc., can solve the problem of large contact thermal resistance, and achieve the reduction of substrate size, contact thermal resistance, and size reduction. Effect
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[0016] figure 2 , image 3 A schematic diagram of the structure of an embodiment of the present invention is given, which can be applied to rectification devices of domestic Shaoshan series electric locomotives and diesel locomotives.
[0017] The press-fit positioning structure mainly consists of the heat pipe radiator substrate 2, the 3-5 inch silicon rectifier element 1 located between the substrates 2, the external conductive connecting plate 3 fixed on the substrate 2, and the fastening mechanism for fastening the substrate 2 and the semiconductor element 1. The elastic press-fit assembly consists of a fastening screw 4, a fastening nut 10, a spring plate 5, a disc spring 6, a steel ball 7, an insulator 8, and a positioning pin 11. The elastic press-fit assembly is arranged on the rectifier The supporting part 9 on the top is fixed and positioned, and the heat pipe radiator base plate 2 is located in the area formed between the elastically pressed fastening screws 4. Th...
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