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Selective plating device

An electroplating device and selective technology, applied in plating baths, circuits, semiconductor devices, etc., to reduce material waste, reduce pollution, and improve efficiency

Active Publication Date: 2009-10-07
SHANGHAI SINYANG SEMICON MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The hook is located above the surface of the plating solution

Method used

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  • Selective plating device
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  • Selective plating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Selective plating devices such as image 3 , Figure 4 As shown, the hook support frame 7 includes two parallel frames 702 and a beam 703, the two frames 702 are connected as a whole through the beam 703, the beam 703 exceeds a part of the frame 702, and the conductive hook 701 is installed on the frame 702. A group of hooks 701 are respectively located on the two frames 702, and the two hooks are arranged in a straight line to form a group to hang a lead frame. The number of the hooks 701 is more than two groups, and more than two groups of the hooks 701 are arranged along the direction parallel to the liquid surface of the electroplating solution, that is, the A direction in the figure, and the number of groups of the hooks can be determined according to actual production needs.

[0045] Such as Figure 5 As shown, the electroplating solution tank 5 is also included, and the part of the beam 703 beyond the frame 702 is mounted on the tank wall of the electroplating ...

Embodiment 2

[0048] It differs from Example 1 in that, as Figure 8 As shown, an overflow hole 506 is provided on the wall of the electroplating solution tank 5, and the overflow hole 506 replaces the overflow tank of the first embodiment, and the rest of the structure is the same as that of the first embodiment.

Embodiment 3

[0050] It differs from Example 1 in that, as Figure 9 As shown, the number of beams 703 is two, and the two beams 703 can ensure the stable placement of the entire frame and reduce shaking, and the rest of the structure is the same as that of Embodiment 1.

[0051] The number of beams 703 can also be adjusted according to actual needs.

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PUM

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Abstract

The invention discloses a selective plating device comprising a plating solution groove provided with an anode therein. The invention is characterized in that the device further comprises a hook supporting frame and more than two sets of hooks which are arranged on the hook supporting frame and are arranged along a direction parallel with liquid surface of the plating solution. The invention has beneficial effects as follows: the device is conveniently used; solid impurities can be reduced during a plating solution adding process; the plating solution overflowing can automatically flow into a reservoir to be recycled; a lead frame can be partially plated, so material is saved by over 25%; post treatment process is eliminated; and the device is simply operated, simply structured and easily manufactured.

Description

technical field [0001] The invention relates to a selective electroplating device. Background technique [0002] Such as figure 1 As shown, in the semiconductor industry, the electronic component body 603 that must be used by many devices includes pins 602 . Before use, the surface of the electronic component body 603 and the pins 602 needs to be electroplated. Due to the application in semiconductor technologies such as integrated circuits, the volume of the electronic component body 603 and the pins 602 is usually very small. In order to meet the needs of large-scale production, use side ribs 604 to connect multiple electronic component bodies 603 and pins 602, and open through holes 601 on the side ribs 604, and use a plurality of hooks on a hook support frame to pass through the through holes. The holes 601 plate multiple sets of electronic component bodies and pins to be electroplated in batches, and the side ribs, electronic component bodies and pins are collectively...

Claims

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Application Information

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IPC IPC(8): C25D5/02C25D17/02C25D7/12
Inventor 王振荣吕海波黄利松
Owner SHANGHAI SINYANG SEMICON MATERIALS
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