Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board
A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of short circuit between wirings, easy disconnection, hindering plating, etc., and achieve the effect of improving the resolution
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[0131] Hereinafter, preferred examples of the present invention will be described in more detail, but the present invention is not limited to these examples.
[0132] (Preparation of Photosensitive Resin Composition)
[0133] The following materials were mixed, and the solution of the photosensitive resin composition of Examples 1-4 and Comparative Examples 1-6 was prepared.
[0134]
[0135] Adhesive polymer solution (solid content: solid content and mass ratio shown in Table 2, solvent (mass ratio): methyl cellosolve / toluene (3 / 2), polymer weight average molecular weight: 30000, solid content Acid value: 196 mgKOH / g in Examples 1 to 4, Comparative Examples 1, 2, and 6, 163 mgKOH / g in Comparative Examples 3 to 5): 113 g (solid content 54 g)
[0136] In addition, the weight average molecular weight of a polymer is measured by gel permeation chromatography (GPC), and calculated by conversion using the calibration curve of standard polystyrene. Conditions of GPC are shown be...
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