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Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of short circuit between wirings, easy disconnection, hindering plating, etc., and achieve the effect of improving the resolution

Active Publication Date: 2009-10-14
株式会社力森诺科
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the residue adheres to the substrate again, when etching is performed after the development process, the metal foil that should be removed by etching remains on the substrate to be protected as residue, so short circuits between wirings are likely to occur
In addition, when plating is performed after the development process, disconnection is likely to occur because the remaining residue on the substrate hinders the formation of plating.

Method used

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  • Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board
  • Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board
  • Photosensitive resin composition, photosensitive element, method for resist pattern formation, and method for manufacturing printed wiring board

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Embodiment

[0131] Hereinafter, preferred examples of the present invention will be described in more detail, but the present invention is not limited to these examples.

[0132] (Preparation of Photosensitive Resin Composition)

[0133] The following materials were mixed, and the solution of the photosensitive resin composition of Examples 1-4 and Comparative Examples 1-6 was prepared.

[0134]

[0135] Adhesive polymer solution (solid content: solid content and mass ratio shown in Table 2, solvent (mass ratio): methyl cellosolve / toluene (3 / 2), polymer weight average molecular weight: 30000, solid content Acid value: 196 mgKOH / g in Examples 1 to 4, Comparative Examples 1, 2, and 6, 163 mgKOH / g in Comparative Examples 3 to 5): 113 g (solid content 54 g)

[0136] In addition, the weight average molecular weight of a polymer is measured by gel permeation chromatography (GPC), and calculated by conversion using the calibration curve of standard polystyrene. Conditions of GPC are shown be...

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Abstract

This invention provides a photosensitive resin composition comprising (A) a binder polymer comprising a divalent group represented by general formula (I), a divalent group represented by general formula (II), and a divalvent group represented by general formula(III), (B) a photopolymerizable compound, and (C) a photopolymerization initiator comprising a hexaarylbiimidazole compound containing at least one alkoxy group having 1 to 5 carbon atoms. (I) (II) (III) wherein R, R, and R each independently represent a hydrogen atom or a methyl group; R and R each independently represent an alkyl group having 1 to 3 carbon atoms, an alkoxy group, an OH group, or a halogen atom; and m and n are each independently an integer of 0 to 5.

Description

technical field [0001] The present invention relates to a method for forming a photosensitive resin composition, a photosensitive element, a resist pattern, and a printed circuit board. Background technique [0002] Conventionally, in the field of manufacturing printed circuit boards, photosensitive elements (laminates) having a structure in which a photosensitive film is formed on a supporting film have been widely used as resist materials for etching, plating, etc. After the resin composition or the layer containing the photosensitive resin composition (hereinafter referred to as "photosensitive resin composition layer"), a protective film is arranged on the photosensitive resin composition layer. [0003] Conventionally, a printed wiring board has been produced, for example, in the following procedure using the photosensitive element described above. That is, first, the photosensitive resin composition layer of the photosensitive element is laminated|stacked on the board...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/031G03F7/004G03F7/033
CPCG03F7/033G03F7/031
Inventor 村松有纪子宫坂昌宏南川华子
Owner 株式会社力森诺科
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