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Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition

一种树脂组合物、密封树脂的技术，应用在半导体器件、半导体/固态器件制造、半导体/固态器件零部件等方向，能够解决没能确实达成裂缝或剥离等问题，达到抑制或降低裂缝或剥离、高可靠性的效果

Inactive Publication Date: 2009-10-14
SUMITOMO BAKELITE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] However, in the combination of conventional materials, there is a problem that the prevention of cracks and peeling cannot be reliably achieved.

Method used

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  • Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition
  • Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition
  • Semiconductor package, core layer material, buildup layer material, and encapsulation resin composition

Examples

Experimental program
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Effect test

Embodiment

[0209] Hereinafter, the present invention is illustrated by examples, but the present invention is not limited thereto.

[0210] 1. Experiments on the physical properties of the cured product of the sealing resin composition

[0211] Sealing resin compositions a-d were prepared. Table 1 shows the composition of the sealing resin composition and the measurement results of the glass transition temperature, linear expansion coefficient, elastic modulus, and viscosity of the cured product of the sealing resin composition. The compounding quantity is a weight part.

[0212] The glass transition temperature was measured by the following procedure: After curing the sealing resin composition at 150°C for 120 minutes, the cured product was cut into a test piece of 5×5×10 mm, and TMA / SS120 manufactured by Seiko I was used to load 5g, The test piece was measured under the condition of a temperature increase rate of 10°C / min within a temperature range of -100°C to 300°C. Measure the co...

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Abstract

Disclosed is a flip chip semiconductor package comprising a circuit board having a core layer and at least one buildup layer, a semiconductor device connected to the circuit board through a metal bump, and a cured product of an encapsulation resin composition which is sealingly interposed between the semiconductor device and the circuit board. The flip chip semiconductor package is characterized in that the cured product of the encapsulation resin composition has a linear expansion coefficient of not less than 15 ppm / DEG C. but not more than 35 ppm / DEG C. between 25 DEG C. and 75 DEG C., and at least one of the buildup layers has a glass transition temperature of not less than 170 DEG C. and an in-plane linear expansion coefficient of not more than 25 ppm between 25 DEG C. and 75 DEG C.. Consequently, a flip chip semiconductor package with high reliability can be obtained by suppressing cracks and separation. Also disclosed are a buildup layer material, a core layer material and an encapsulation resin composition.

Description

technical field [0001] The technical field of the present invention is generally the field of semiconductor packages, and more specifically, the field of flip-chip semiconductor packages. Background technique [0002] With the increasing demand for higher functions and smaller volumes of electronic devices in recent years, the high-density integration and high-density mounting of electronic components have been continuously developed, and the semiconductor packages used in these electronic devices have become more and more complex than before. come smaller. [0003] In this case, in the field of semiconductor packages, conventional packages using lead frames have limitations in miniaturization. Therefore, in recent years, surface mount packages in which chips are mounted on circuit boards have been proposed. (such as Ball Grid Array Package (BGA) and Chip Scale Package (CSP)). Among these semiconductor packages, wire bonding, TAB (tape automated bonding) and flip chip (FC)...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/29C08L63/00C08L101/00H01L23/12H01L23/14H01L23/31
CPCH01L23/293H01L2224/16H05K3/305H01L2924/10253H01L23/3737H01L21/563H05K2201/068H01L2224/73204C08L63/00H05K2201/10674H01L23/3735H01L23/49822H05K1/0271H01L2224/16227H01L2924/01019H01L2924/01078H01L2224/16225H05K2201/10977H01L2224/73203H05K3/4602H01L2224/32225H01L2924/01079H01L2924/0102H01L2924/00014H01L2924/00H01L2224/0401C08L101/00H01L23/12H01L23/29
Inventor 橘贤也和田雅浩川口均中村谦介
Owner SUMITOMO BAKELITE CO LTD
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