Intermediate frequency transceiving chip

Abstract

The invention relates to an intermediate frequency transceiving chip, integrated by an analog to digital conversion circuit ADC, a digital to analog conversion circuit DAC, a digital down conversion circuit DDC, a direct digital synthesizer DDS and an interface control circuit. The digital signal converted from an intermediate frequency analog signal is treated by the DDC, the digital signal outputted by the DDS is converted to an analog signal which is treated by a RF front end synchronously. By integrating various functional circuits which are used for intermediate frequency transceiving in one single chip, the chip volume, the power consumption and the cost are reduced; the interference which exists in original board-level circuit is eliminated, thus improving the reliability and maintainability of the system and simplifying the complexity of the system of an intermediate frequency transceiver.

Description

technical field [0001] The invention relates to the communication field, in particular to an intermediate frequency signal transceiver chip located between a baseband and a radio frequency front end. Background technique [0002] With the in-depth development of the integrated circuit industry, the single-chip solution that integrates various functional modules into one chip and completes the functions completed by several chips in the past has become the mainstream of development. Single-chip implementation has the following advantages. 1. A single chip has higher integration and more complex functions. At the same time, a single chip can reduce the interference between various modules and improve the overall performance of the system; 2, the single chip implementation has a smaller area, which means more cost advantages; 3, the single chip implementation has smaller power 4. A single chip can simplify application circuit design and make it more convenient for users to us...

AI Technical Summary

Problems solved by technology

Traditional IF transceivers are composed of multiple chips, including analog-to-digital conversion chips, digital down-conversion chips, digital-to-analog conversion chips, direct digital frequency synthesis chips, etc. The system composed of multiple chips is large in size, high in power consumption, and high in cost. high maintenance costs

Images