Method for preparing modified phenolic resin

A phenolic resin and modification technology, which is applied in the field of preparation of modified phenolic resin, can solve problems such as heat resistance, solvent resistance, copper clad laminate flame retardancy, insufficient moisture resistance, and failure to meet production requirements. Achieve the effects of high electrical insulation, increased flexibility, and low manufacturing cost

A phenolic resin and modification technology, which is applied in the field of preparation of modified phenolic resin, can solve problems such as heat resistance, solvent resistance, copper clad laminate flame retardancy, insufficient moisture resistance, and failure to meet production requirements. Achieve the effects of high electrical insulation, increased flexibility, and low manufacturing cost

CN101591418AInactive Publication Date: 2009-12-02福建利豪电子科技股份有限公司
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] According to the composition of raw materials in Table 1, under the condition of stirring in the reactor, feed No. 1, No. 2, No. 3 and No. 4 materials in sequence. When the above four raw materials are put in, stir for 10 minutes, put in No. 5 material and start to heat up, and the temperature will rise to 78°C in 30-40 minutes, start recording the reaction time, and keep it at 80±2°C for 120 minutes. After the heat preservation is over, add No. 6 raw material to cool. When cooling below 60°C, take a sample to measure the viscosity. If the viscosity is in the range of 300cps-600cps, pump it into the reactor, put in No. 7, No. 8 and 20g of No. 9 in turn, and then start to heat up. After 40±10 minutes, the temperature was raised to 78°C and the reaction time was measured, and the reaction temperature was controlled at 80-90°C. After the reaction temperature stabilized (about 50-60 minutes), 20g of No. 9 material was added to keep the reaction temperature at 80-90°C. 90°C...

Embodiment 2

[0039] According to the composition of raw materials in Table 1, under the condition of stirring in the reactor, feed No. 1, No. 2, No. 3 and No. 4 materials in sequence. When the above four raw materials are put in, stir for 10 minutes, put in No. 5 material and start to heat up, and the temperature will rise to 78°C in 30-40 minutes, start recording the reaction time, and keep it at 80±2°C for 120 minutes. After the heat preservation is over, add No. 6 raw material to cool. When cooling below 60°C, take a sample to measure the viscosity. The viscosity is in the range of 300cps-600cps, pump it into the reactor, put in No. 7, No. 8 and 40g of No. 9 in turn, and then start to heat up. After 40±10 minutes, the temperature was raised to 78°C and the reaction time was measured, and the reaction temperature was controlled at 80-90°C. After the reaction temperature stabilized (about 50-60 minutes), 35g of No. 9 material was added to keep the reaction temperature at 80-90°C. 90°C. ...

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Abstract

The invention relates to a method for preparing a modified phenolic resin for a paper-base copper clad laminate substrate resin. In the method, cardanol is adopted together with an epoxide vegetable oil to modify a phenolic resin, the usage amount of tung oil is reduced considerably, the copper clad laminate manufactured by using the modified phenolic resin as a main resin has the advantages of excellent flexibility, low water absorptivity, high electrical insulation in wet state, low manufacturing cost and the like, and at the same time, a melamine resin is added to further modify the phenolic resin, so the drawback that the phenolic resin changes color due to the light is inhibited obviously and the modified phenolic resin prepared by the method can meet requirements on appearance color.

Description

technical field [0001] The invention relates to a preparation method of a modified phenolic resin used for a base material resin of a paper-based copper-clad laminate. Background technique [0002] In the manufacture of phenolic paper-based copper-clad laminates, the products made of pure phenolic resins have shortcomings such as brittleness, poor punching performance, high water absorption, and low electrical insulation. Generally, the resin must be modified. Most of them use tung oil to modify phenolic resin as the main resin of paper-based copper clad laminates. Tung oil is obtained by pressing the fruit of the tung oil tree. In recent years, due to the continuous increase in demand for tung oil, the price has continued to rise, which has brought great cost pressure to the production of copper clad laminate manufacturers. It is of great significance for the production of copper clad laminates to find cheap materials to replace or partially replace tung oil and reduce pr...

Claims

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Application Information

Patent Timeline
02 Dec 2009
Publication
CN101591418A
IPC
C08G8/28; C08G8/10
Inventors
余青川; 傅子芬