Memory module

Abstract

The invention discloses a memory module comprising a circuit substrate and a cooling fin. The circuit substrate is provided with a plurality of chip packaging bodies, and a gap is formed between the adjacent chip packaging bodies; the cooling fin is attached to the chip packaging bodies and is provided with a plurality of openings corresponding to the gaps so as to form a heat current air chamber for an airflow to enter the gaps and exchange heat with the chip packaging bodies.

Description

technical field [0001] The present invention relates to memory modules, in particular to a memory module with heat sinks. Background technique [0002] With the vigorous development of the information technology industry and the increasing popularity of information media applications, a large number of various information products appear in daily life. If the data processing capability of information products is to be improved, in addition to the faster computing speed of the microprocessor, the associated memory also plays a very important role. This kind of memory that emphasizes high-speed access and operates with a microprocessor is called random access memory (Random Access Memory; RAM), and its common specifications in the industry are: Synchronous Dynamic Random Access Memory (Synchronous Dynamic Random Access Memory; SDRAM ), double synchronous dynamic random access memory (Double Data Rate SDRAM; DDR SDRAM), the second generation of double synchronous dynamic rando...

AI Technical Summary

Problems solved by technology

[0005] However, the heat sink of the memory usually covers one side of the memory and covers all the memory chips. Because there are gaps between the memory chips, these gaps are covered by the heat sink, forming a semi-closed airflow that cannot convect. space, making it difficult for the sides of each memory chip to dissipate heat

Once the memory operates for too long, the heat will continue to accumulate on the sides and intervals of the memory chip and is difficult to dissipate, making the memory temperature too high

Although the heat sink of some high-speed memories has mesh holes, it will reduce the contact area between the top surface of the memory chip and the heat sink, which will affect the heat conduction and reduce the heat dissipation efficiency.

Therefore, as far as the high-speed memory is currently used, there is no design that can take into account the heat dissipation efficiency of each part of the memory chip at the same time, and there is still room for further improvement.

Images