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Method for manufacturing building template by using waste circuit board

A technology for waste circuit boards and building templates, which is applied to the on-site preparation of building components, construction, building construction, etc., can solve the problems of increasing crushing equipment, increasing production processes and production costs, and reducing consumption and production costs. , the effect of simple production process

Inactive Publication Date: 2009-12-23
SHANGHAI QIMOU ENERGY SOURCE TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

This invention does make some use of waste circuit boards, but in the process of utilization, the waste circuit boards need to be crushed, and the crushing process itself requires additional crushing equipment and power consumption on the one hand, and increases the production process and production costs on the other hand.

Method used

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  • Method for manufacturing building template by using waste circuit board

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Embodiment Construction

[0014] Refer to attached figure 1 , with figure 1 A schematic diagram of the principle of an embodiment of a method for making building templates provided by the present invention is described: After brushing the release agent on the lower plane plate 2, the lower glass fiber cloth 4 is spread on it, and on the glass fiber cloth 4 Brush FRP glue on top, then splice and place waste circuit boards 7 in the horizontal direction on top, brush the FRP glue and then splice and place waste circuit boards in the longitudinal direction 6, after brushing FRP glue, splice and place waste circuit boards in the horizontal direction Plate 5, cover the waste circuit board 5 with glass fiber cloth 3 on it, brush glass fiber reinforced plastic glue on the glass fiber cloth 3, then press the upper plane plate 1 that has been coated with a release agent, and take it out after curing. Architectural template.

[0015] The above-mentioned embodiments illustrate the present invention, but do not l...

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Abstract

The invention discloses a method for manufacturing a building template by using a waste circuit board, aims to overcome the defects of the prior art, and provides the method for manufacturing the building template by the waste circuit board, which can directly use the waste circuit board and has simple process, low cost and easy implementation. The method comprises the following steps: splicing the waste circuit boards according to the thickness and the size of the building template, painting resin adhesive on the waste circuit boards while splicing; spreading glass fiber cloth on two sides to coat the spliced board inside, and painting the resin adhesive on glass fiber; and curing the manufactured template in a mould to produce the building template. The method can be used for utilizing the waste circuit boards.

Description

technical field [0001] The invention relates to a method for processing waste circuit boards of electronic waste, in particular to a method for making building templates by using waste circuit boards. technical background [0002] Now with the increasing use of electronic products, more and more electronic waste is generated. How to effectively deal with electronic waste is a worldwide environmental protection issue. The most difficult thing to deal with in these electronic wastes is the waste circuit board, and now there are some technologies that can process the waste circuit board, such as the patent application number 200510038342.3 invention title "Circuit Board Recycling Powder Manhole Cover" announced by the Chinese Patent Office on August 16, 2006 The method introduced in " / seat and its manufacturing method" is used to make the manhole cover after crushing the waste circuit board. This invention does make some use of waste circuit boards, but in the process of utili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B38/00B32B3/22B32B7/12B32B17/02E04G11/00
Inventor 王武生
Owner SHANGHAI QIMOU ENERGY SOURCE TECH DEV
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