Processing method for copper target material

A processing method, copper target technology, applied in metal material coating process, ion implantation plating, coating, etc., can solve problems such as copper deformation, surface roughness affecting surface lines, etc., to reduce deformation and reduce scratches Injury, cost reduction effect

Active Publication Date: 2010-01-06
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The problem solved by the present invention is that in the prior art, when copper is processed to make a

Method used

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  • Processing method for copper target material
  • Processing method for copper target material
  • Processing method for copper target material

Examples

Experimental program
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Embodiment approach

[0026] refer to figure 1 As shown, an embodiment of the processing method of the copper target of the present invention includes:

[0027] Step s1, fixing the copper workpiece with a full-circumference fixture, and performing the first mechanical processing;

[0028] Step s2, performing stress release on the copper workpiece;

[0029] Step s3, fixing the copper workpiece with a full-circumference fixture, and performing the second machining, the precision of which is higher than that of the first machining;

[0030] In step s4, the copper workpiece is fixed with a full-circumference fixture, and the third machining is performed, the precision of which is higher than or equal to that of the second machining.

[0031] In the above embodiment, the first machining is rough machining, the purpose of which is to remove most of the allowance of the copper workpiece to obtain a more regular semi-finished product, that is, to cut out the approximate shape of the target. The second m...

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Abstract

The invention provides a processing method for copper target materials, comprising the following steps: a copper workpiece is processed through mechanical processing with gradually increasing accuracy for three times, wherein the copper workpiece is fixed by a full-wave clamp in three times of mechanical processing processes, and stress release is carried out on the copper workpiece at least between the first mechanical processing and the second mechanical processing. The copper target materials obtained through the processing method for the copper target materials has better consistency of surface grains and lower surface roughness.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a copper target processing method. Background technique [0002] The quality of thin films formed on substrates by sputtering methods can be affected by the surface roughness of the target used for sputtering. When protrusions with a size exceeding a certain level exist on the target surface, abnormal discharge (micro-arc discharge) may be generated on the protrusions. The abnormal discharge can cause large particles to be splashed from the surface of the target and deposited on the substrate. Deposited large particles can form spots on thin films and cause short circuits in semiconductor devices. [0003] Many materials can be used to make targets, including copper, aluminum, titanium, and more. In specific applications, the target material may include an alloy or a mixture of other metals, such as one or more of copper, aluminum, and titanium. Targets may also com...

Claims

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Application Information

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IPC IPC(8): C22F1/08C23C14/34C23C14/14
Inventor 姚力军潘杰王学泽鲍伟江刘庆
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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