Method for manufacturing CTI copper-clad laminate

A technology of copper clad laminates and manufacturing methods, applied in lamination, bonding methods of adhesive heating, lamination devices, etc., can solve the problems of resin component aging, poor insulation performance of substrates, etc., and prolong the service life , Improve the effect of tracking voltage resistance

Active Publication Date: 2010-02-24
SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the surface of the PCB substrate is tracked due to micro-leakage, on the one hand, heat is generated, which ages the resin components on the substrate surface; on the other hand, under the action of a high-voltage electric field, electron migration and denaturation will occur in the resin structure. The insulation performance of the substrate is getting worse and worse

Method used

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  • Method for manufacturing CTI copper-clad laminate
  • Method for manufacturing CTI copper-clad laminate
  • Method for manufacturing CTI copper-clad laminate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] 1. Mixing formula:

[0057] Low bromine epoxy resin (Br: 10%) 125

[0058] Dicyandiamide 3.0

[0059] Dimethylformamide 30

[0060] Dimethylimidazole 0.070

[0061] Aluminum hydroxide 30

[0062] 2. Prepreg control parameters

[0063] Gluing machine oven temperature: 190°C

[0064] Gluing speed: 15m / min

[0065] Resin content: 43%

[0066] Gel time: 105s

[0067] Liquidity: 21%

[0068] Volatile matter: 0.35%;

[0069] 3. Arranging boards

[0070] 8 pieces of 7628 prepreg (1.6mm board material), the copper foil is H OZ.

[0071] 4. Thermoforming

[0072] Hot pressing temperature: 185°C

[0073] Pressure: 30kg / cm 2

[0074] Hot pressing time: 90min

[0075] 5. The basic performance parameters are as follows in Table 2:

[0076] Table 2

[0077]

[0078] 4. Thermal stress at 288°C

Embodiment 2

[0080] 1. Mixing formula:

[0081] Low bromine epoxy resin (Br: 14%) 125

[0082] Dicyandiamide 3.2

[0083] Dimethylformamide 32

[0084] Dimethylimidazole 0.065

[0085] Aluminum hydroxide 45

[0086] 2. Prepreg control parameters

[0087] Gluing machine oven temperature: 200°C

[0088] Gluing speed: 17m / min

[0089] Resin content: 46%

[0090] Gel time: 95s

[0091] Liquidity: 22%

[0092] Volatile matter: 0.35%;

[0093] 3. Arranging boards

[0094] 8 pieces of 7628 prepreg (1.6mm board material), copper foil is 1OZ.

[0095] 4. Thermoforming

[0096] Hot pressing temperature: 200°C

[0097] Pressure: 30kg / cm 2

[0098] Hot pressing curing time: 60min

[0099] 5. The basic performance parameters are as follows in Table 3:

[0100] table 3

[0101]

Embodiment 3

[0103] 1. Mixing formula:

[0104] Low bromine epoxy resin (Br: 12%) 133

[0105] Dicyandiamide 3.4

[0106] Dimethylformamide 34

[0107] Dimethylimidazole 0.060

[0108] Aluminum hydroxide 30

[0109] 2. Prepreg control parameters

[0110] Gluing machine oven temperature: 210°C

[0111] Gluing speed: 20m / min

[0112] Resin content: 45%

[0113] Gel time: 100s

[0114] Liquidity: 22%

[0115] Volatile matter: 0.30%;

[0116] 3. Arranging boards

[0117] 6 pieces of 7628 prepreg (1.2mm board material), copper foil is 2OZ.

[0118] 4. Thermoforming

[0119] Hot pressing temperature: 210°C

[0120] Pressure: 30kg / cm 2

[0121] Hot pressing time: 40min

[0122] 5. The basic performance parameters are as follows in Table 4:

[0123] Table 4

[0124]

[0125] The present invention focuses on the research of the epoxy resin system used in copper-clad laminates: FR-4 laminates usually use brominated epoxy resin, and the Br---C bond often makes the polarity of the...

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PUM

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Abstract

The invention relates to a method for manufacturing a CTI copper-clad laminate. The method is realized by the following steps: glue mixing, sizing, plate arrangement, hot-press molding, disassembly, processing and inspecting, wherein an adhesive system in the step of the 'glue mixing' is composed of the following materials in mass ratio (kg): 125 to 133 kg of low brominated epoxy resin, 2.60 to 3.40 kg of dicyandiamide, 30 to 36 kg of dimethyl formamide, 0.060 to 0.080 kg of dimethyl imidazole, and 10 to 40 kg of aluminum hydroxide, wherein the low brominated epoxy resin belongs to tetrabromobisphenol A type brominated epoxy resin, and the content of bromine accounts for 10 to 14 mass percent of the low brominated epoxy resin. The method has the advantage of improving the tracking voltageresistance of a PCB substrate.

Description

technical field [0001] The invention relates to a method for manufacturing a copper-clad laminate (CTI600), in particular to an adhesive used in the method. Background technique [0002] With the rapid development of the information industry and the rapid development of electronic technology, electronic and electrical products are increasingly integrated, which puts forward higher requirements for the core structure of electronic and electrical appliances ----- PCB board. [0003] The continuous improvement of high-density wiring technology and people's pursuit of the stability of electronic and electrical equipment require PCB substrates to have high reliability, especially for electrical equipment used in harsh environments, which must maintain long-term reliability. [0004] During the use of electrical products, there is current transmission on the wiring of the PCB substrate. Under the action of the electric field, micro-discharge, that is, micro-leakage tracking phenom...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12B32B37/06B32B37/10B32B37/14B32B38/16C09J163/00C09J5/06
Inventor 韩涛
Owner SHANGHAI GUOJI ELECTRONICS MATERIALS CO LTD
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