Manufacturing method for printed wiring board with dense disk holes

Abstract

The invention relates to a manufacturing method for a printed wiring board with dense disk holes, comprising the steps of: 1 once boring a hole, 2 once plating copper on the board surface and a wall of a hole of a printed wiring board and only partially plating the wall of the hole, 3 making a pattern of plating hole, 4 plating copper on the part of the hole which is not plated, 5 filling the holewith resin by adopting silk-screen in vacuum, 6 withdrawing a film, 7 grinding a printed wiring board with an abrasive band grinding machine and a four-axle unwoven cloth graining machine, 8 secondarily plating copper on the board, 9 drying a film on the outer layer, 10 plating the pattern and 11 etching the outer layer. The invention manufactures the products with dense disk holes with a line width and line-spacing of 4 / 4mil, by once plating copper on a 10um hole. The problems of partially filled tap-hole, hollow resin, resin foam, etc., are efficiently solved by adopting the vacuum silk-screen technique and the problems of difficult grinding of resin, sunken resin, unevenly cutting of the copper on the board surface, etc., are efficiently solved by grinding with abrasive band and four-axle unwoven cloth graining technique.

Description

technical field [0001] The invention relates to a method for manufacturing a printed circuit board, in particular to a method for manufacturing a printed circuit board with holes in a highly dense disk. Background technique [0002] With the rapid development of electronic technology, electronic products are developing in the direction of miniaturization, portability, multi-function, high integration and high reliability, and the packaging of semiconductor components is also developing rapidly towards multi-pin and fine-pitch, which requires corresponding requirements. The printed circuit boards of semiconductor components not only need to be multi-layered, and the area that can be routed can be increased by increasing the number of layers, but also need to be small, lightweight and high-density. In order to meet the needs of high wiring density placed in more and more functions of electronic products, through holes or stacked hole structures are mainly used to connect the c...

AI Technical Summary

Problems solved by technology

[0006] Another object of the present invention is to provide a method for manufacturing a printed circuit board with high-density disk holes, which uses abrasive belt and four-axis non-woven grinding technology for combined grinding, effectively solving resin grinding difficulties, resin depressions, Problems such as excessive product size changes, uneven copper thickness reduction on the board surface, etc.

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