The invention relates to a manufacturing method for a printed wiring board with dense disk holes, comprising the steps of: 1 once boring a hole, 2 once plating
copper on the board surface and a wall of a hole of a printed wiring board and only partially plating the wall of the hole, 3 making a pattern of plating hole, 4 plating
copper on the part of the hole which is not plated, 5 filling the holewith resin by adopting silk-screen in vacuum, 6 withdrawing a film, 7
grinding a printed wiring board with an
abrasive band
grinding machine and a four-axle unwoven cloth graining
machine, 8 secondarily plating
copper on the board, 9
drying a film on the outer layer, 10 plating the pattern and 11
etching the outer layer. The invention manufactures the products with dense disk holes with a
line width and line-spacing of 4 / 4mil, by once plating copper on a 10um hole. The problems of partially filled tap-hole, hollow resin, resin foam, etc., are efficiently solved by adopting the vacuum silk-screen technique and the problems of difficult
grinding of resin, sunken resin, unevenly
cutting of the copper on the board surface, etc., are efficiently solved by grinding with
abrasive band and four-axle unwoven cloth graining technique.