Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof

Abstract

A silicon-based vapor-liquid phase separating heat radiation chip and a preparation method thereof relate to a heat radiation chip of electronic components. The silicon-based vapor-liquid phase separating heat radiation chip and the preparation method thereof are provided to overcome the disadvantages of a silicon-based radiator and improve heat radiation efficiency of the silicon-based radiator.The heat radiation chip is in an upper and lower-layer structure, and is provided with an upper silicon slice and a lower silicon slice respectively, wherein the upper silicon slice is provided with a cooling liquid loading port, a liquid vaporizer and a gas microchannel; and the lower silicon slice is provided with a cooling liquid storage tank and a liquid microchannel. The preparation method has the following steps: 1), processing the front structure of the upper silicon slice; 2), processing the back structure of the upper silicon slice; 3), processing the lower silicon slice; and 4) aligning the upper silicon slice and the lower silicon slice for bonding.

Description

technical field [0001] The invention relates to a heat dissipation chip for electronic components, in particular to a silicon-based vapor-liquid phase separation type heat dissipation chip and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics technology, the integration of chips is getting higher and higher, and the performance is getting stronger and stronger, which eventually leads to a sharp increase in power consumption per unit area, resulting in a fatal high heat flux problem. The heat dissipation problem of high heat flux chips has become a bottleneck restricting the development of high-integration chip technology. The improvement of the reliability of electronic components, the increase of power capacity, the improvement of integration and the miniaturization of the structure all directly depend on the heat dissipation of the chip. problem solving. At present, micro-radiators made of silicon based on semicondu...

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Problems solved by technology

[0005] 2. The existing silicon-based radiators need to add structures such as micropumps and microvalves to drive the circulation of microfluids, which makes the structure of the radiator more complicated and is not conducive to miniaturization

In addition, micropumps also require additional energy to drive, which is not conducive to environmental protection

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