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Double-module device

A dual-module, image module technology, which is applied to antenna supports/installation devices, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problems of time-consuming installation, increased production costs and installation man-hours, complex internal structure of electronic products, etc. , to achieve the effect of saving man-hours and production costs

Inactive Publication Date: 2010-03-17
LITE ON ELECTRONICS (GUANGZHOU) LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a setting method not only makes the internal structure of the electronic product complicated, but also takes time to install, which increases the production cost and installation man-hours

Method used

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Embodiment Construction

[0022] see figure 1 and figure 2 shown. A preferred embodiment of the dual module device 20 of the present invention is applied as figure 1 shown on the notebook computer 10. The dual module device 20 is installed above the display screen 101 of the notebook computer 10 .

[0023] The dual-module device 20 of the present invention includes: a substrate 201 , an image module 202 , and a wireless network module 203 . The substrate 201 is a printed circuit board (Printed Circuit Board, referred to as PCB) or a flexible circuit board (Flexible Printed Circuit, referred to as FPC); and the image module 202 and the wireless network module 203 are welded on the substrate 201, The substrate 201 electrically connects the image module 202 and the wireless network module 203 to facilitate information transmission. Wherein, the image module 202 is arranged near the center of the display screen, and the wireless network module 203 is arranged on both sides of the image module 202 . ...

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Abstract

The invention discloses a double-module device, comprising a base plate, an image module and a wireless network module; wherein the double-module device is arranged on corresponding electronic productby the base plate, the image module and the wireless network module are arranged on the base plate, and data transmission between the image module and the wireless network module is carried out by the base plate. The double-module device also comprises an antenna module used for communication. The wireless network module is integrated on the base plate by system-in package technology such as SIPor SOC and the like. The double-module device of the invention reduces the volume of the wireless network module, not only the interior space of electronic product is large, but also communication between the image module and the wireless network module can be carried out without connection of data line; in addition, not only production cost is saved, but also man-hours in mounting and dismountingare reduced.

Description

technical field [0001] The invention relates to a dual-module device, in particular to a dual-module device integrating an image module and a wireless network module. Background technique [0002] A brief introduction to system integration technology, referred to as SIP (system in package), or SOC (system on chip) technology, is a technology that uses packaging technology to integrate modules into chips or integrated circuits with a single goal. The chip or integrated circuit contains the entire content of a complete system and embeds all software; in other words, the integrated chip or integrated circuit includes the entire content of the integrated target module, including software / hardware parts, and is a tiny system . In order to save production costs and reduce the volume of products, making them beautiful and easy to carry, system integration technology has been applied more and more. [0003] The limited volume of portable electronic products requires more functiona...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01Q1/22H01L23/13
Inventor 蓝伟豪林俊隆李宜明
Owner LITE ON ELECTRONICS (GUANGZHOU) LTD