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Manufacturing method of film construction body

A manufacturing method and thin-film technology, applied in the field of microelectronics manufacturing, can solve problems such as reducing the number of masks used, and achieve the effects of improving yield, reducing cost, and simplifying the process

Active Publication Date: 2012-02-29
K TRONICS (SUZHOU) TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, there is no disclosure in the prior art that when patterns are respectively formed on the multilayer film through a mask plate, the upper surface of the pattern of the multilayer film can be flattened to reduce the occurrence of disconnection and short circuit. At the same time, a technical solution that can reduce the number of masks used

Method used

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  • Manufacturing method of film construction body
  • Manufacturing method of film construction body
  • Manufacturing method of film construction body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] see figure 2 , is a flow chart of the manufacturing method of the thin film structure of the present invention, comprising the following steps:

[0055] Step 1: providing a motherboard with a first recess and a second recess on the upper surface, and the first recess is deeper than the second recess;

[0056] Step 2: Continuously depositing a first substance layer and a second substance layer with different thicknesses on the motherboard;

[0057] Step 3: Grinding the motherboard completed in step 2 to form a flat upper surface, and the first concave portion has a first material layer and a second material layer, and the second concave portion only has the first material layer.

[0058] Combine below Figures 3A-3E The method for manufacturing the thin film structure of the present invention will be described in detail.

[0059] see Figures 3A-3E , Figure 3A It is a cross-sectional view of the present invention after forming a photosensitive layer on a motherboa...

Embodiment 2

[0075] In the method for manufacturing an array substrate of a fringe electric field switching liquid crystal display of the present invention, the array substrate is composed of a display area and a non-display area, the non-display area includes a TFT area and a wiring area between the display areas, and the wiring area The line area includes the gate line area and the common electrode area, which includes the following steps.

[0076] Step 1: Provide a motherboard with a first recess and a second recess on the upper surface, and the first recess is deeper than the second recess, wherein the first recess corresponds to the gate line area and the TFT area, and the second recess corresponds to common electrode area.

[0077] Step 2: Continuously deposit transparent conductive layers and gate metal layers with different thicknesses on the motherboard.

[0078] Step 3: Grinding the motherboard completed in step 2 to form a flat upper surface, and the first concave portion has a...

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Abstract

The invention discloses a manufacturing method of film construction body, which is characterized in that it includes the following steps: providing a motherboard whose upper surface is provided with a first recess and a second recess, wherein the first recess is deeper than the second recess; continuously depositing first substance layers and second substance layers with different thickness on the motherboard; grinding the motherboard to form a flat upper surface, wherein the first recess includes first substance layers and second substance while the second recess only includes first substance layers. The invention also discloses a manufacturing method of edge electric field switching type LCD array substrate. In the invention, a flat upper surface can also be formed, and simultaneously a mask layer plate can be adopted to respectively form figures on two layers of films.

Description

technical field [0001] The invention relates to a method for manufacturing a film structure with a flattened upper surface, in particular to a method for manufacturing a thin film structure with a flat upper surface that uses a mask to form patterns on two layers of films, and at the same time, belongs to field of microelectronics manufacturing. The invention also relates to a method for manufacturing the array substrate of the fringe electric field liquid crystal display. Background technique [0002] Thin film processes are widely used in the manufacture of microelectronics. The general process steps are to deposit various thin films such as metal layer, insulating layer, and semiconductor layer on a flat base material, and form patterns through photolithography to realize its circuit function. The so-called photolithography process is to form a photosensitive layer (photoresist) on the film through exposure and development through a pre-designed mask plate, and remove t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/00H01L21/84
CPCH01L29/66765H01L27/1214H01L29/78603H01L27/1218
Inventor 刘圣烈宋泳锡崔承镇
Owner K TRONICS (SUZHOU) TECH CO LTD