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Electronic assemblies without solder and methods for their manufacture

A circuit assembly and component technology, which is applied in the directions of printed circuit manufacturing, electrical components, and electro-solid devices, can solve problems such as high energy density that reduce the reliability of electronic products, and achieve the effect of low cost and low profile.

Inactive Publication Date: 2010-03-24
OCCAM PORTFOLIO LLC (US)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

While such solutions offer benefits in certain applications, the chip's input / output (I / O) terminals can be very small and it becomes a challenge to precisely make such connections
Also, the finished device may not successfully pass the burn-in test, thus negating all previous efforts
[0018] Another area of ​​concern is thermal management, since densely packed ICs produce high energy densities that reduce electronics reliability

Method used

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  • Electronic assemblies without solder and methods for their manufacture
  • Electronic assemblies without solder and methods for their manufacture
  • Electronic assemblies without solder and methods for their manufacture

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Embodiment Construction

[0070] In the following description and accompanying drawings, specific terms and reference numerals are proposed to provide a thorough understanding of the present invention. In some cases, the terms and labels may contain specific details not necessary to practice the invention. For example, interconnections between conductor elements of a component (i.e., I / O leads of a component) may be shown or described as having multi-conductors interconnected to a single lead, or as interconnects within or between devices A single conductor signal line in contact with multiple components. Thus, each of the multi-conductor interconnects may alternatively be a single-conductor signal, control, power or ground line, or vice versa. Circuit paths shown or described as single-ended may also be differentiated, and vice versa. Interconnect assemblies can consist of standard interconnects; microstrip or stripline interconnects and all signal lines of the assembly can be shielded or unshielded...

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Abstract

The present invention provides an electronic assembly (400) and a method for its manufacture (800, 900, 1000 1200, 1400, 1500, 1700). The assembly (400) uses no solder. Components (406), or componentpackages (402, 802, 804, 806) with I / O leads (412) are placed 800 onto a planar substrate (808). The assembly is encapsulated (900) with electrically insulating material 908 with vias (420, 1002) formed or drilled (1000) through the substrate (808) to the components' leads (412). Then the assembly is plated (1200) and the encapsulation and drilling process (1500) repeated to build up desired layers (422, 1502, 1702).

Description

[0001] Cross References to Related Applications [0002] This application is based on, and claims priority from, the following provisional applications: U.S. Application No. 60 / 928,467, filed May 8, 2007, entitled "ELECTRONIC ASSEMBLY WITHOUTSOLDER"; U.S. Application No. 60, filed May 29, 2007 / 932,200, titled "ELECTRONIC ASSEMBLY WITHOUT SOLDER AND METHODS FORTHEIR MANUFACTURE"; U.S. Application No. 60 / 958,385, filed July 5, 2007, titled "SOLDERLESS FLEXIBLE ELECTRONIC AS SEMBLIES ANDMETHODS FOR THEIR MANUFACTURE"; July 2007 U.S. Application No. 60 / 959,148, filed on the 10th, entitled "ELECTRONIC ASSEMBLIES WITHOUTSOLDER ANDMETHODS FOR THEIR MANUFACTURE"; PRINTED CIRCUITBOARD BY MEANS OF AN ADHESIVE LAYER HAVING EMBEDDED CONDUCTIVE JOINING MATERIALS"; U.S. Application No. 60 / 963,822, filed August 6, 2007, entitled "SYSTEM FOR THE MANUFACTURE OFELECTRONIC ASSEMBLIES WITHOUT SOLDER"; filed August 2007 U.S. Application No. 60 / 966,643, entitled "ELECTRONIC ASSEMBLIES WITHOUTSOLDER...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H01L23/538
CPCH01L2924/01063H01L2924/14H05K3/4664H01L2924/15311H05K3/1241H01L2224/73265H05K1/185H01L2924/01013H01L2224/32225H05K2201/10719H01L2224/48091H05K2203/1469H01L2924/01029H01L2224/48247H01L2224/48465H05K2201/10628H05K2201/10689H01L2924/3025H01L2924/01078H01L2224/48227H01L2924/01079H05K3/4602H01L24/73H01L2924/00014H01L2924/00H01L2924/00012H01L23/12H05K3/34
Inventor 约瑟夫·C·菲耶尔斯塔德
Owner OCCAM PORTFOLIO LLC (US)