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Non-halogen cleaning-free soldering flux

A no-cleaning, flux technology, applied in welding media, welding equipment, welding/cutting media/materials, etc., can solve the problems of solder joint corrosion, excessive post-weld residue, insufficient electrical performance reliability, etc. Strong wet strength, superior solderability, and satisfactory results

Inactive Publication Date: 2010-04-07
宁波喜汉锡焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The technical problem to be solved by the present invention is to provide a halogen-free no-cleaning flux to solve problems such as excessive post-soldering residues in existing fluxes, insufficient reliability of electrical properties and solder joint corrosion caused by the existence of halogens. , at the same time, it is necessary to minimize the negative impact on the environment

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Halogen-free no-clean flux, the weight percentage of each component is:

[0026] Stannous oxalate 3

[0027] Methylsuccinic acid 1

[0028] Itaconic acid 0.2

[0029] Fumaric acid 0.2

[0030] Diethylene glycol dimethyl ether 3

[0031] OP-7 0.25

[0032] Isopropanol balance

[0033] Specific preparation method: Take the above-mentioned ingredients, first add a solvent into a reaction kettle with a stirrer, heat to control the temperature at the melting point of the solvent, stir and add stannous oxalate, organic acid active agent, and co-solvent, and stir until the solution is transparent, that is It is a halogen-free no-clean flux.

[0034] The flux is tested with the Japanese Industrial Standard JISZ 3197-1999, the expansion rate is ≥85%, and the surface insulation resistance value S.I.R is ≥1×10 12 Ω.

Embodiment 2

[0036] Halogen-free no-clean flux, the weight percentage of each component is:

[0037] Stannous oxalate 0.5

[0038] Succinic acid 4

[0039] Adipic acid 3

[0040] Malic acid 3

[0041] OP-10 1

[0042] Ethanol 15

[0043] Isopropanol Balance

[0044] The preparation method is the same as in Example 1.

[0045] The flux is tested with the Japanese Industrial Standard JISZ 3197-1999, the expansion rate is ≥85%, and the surface insulation resistance value S.I.R is ≥1×10 12 Ω.

Embodiment 3

[0047] Halogen-free no-clean flux, the weight percentage of each component is:

[0048] Stannous oxalate 1.5

[0049] Phthalic acid 1.5

[0050] Succinic anhydride 3

[0051] Azelaic acid 4

[0052] OP-7 0.1

[0053] Ethanol 15

[0054] Methanol 35

[0055] Isopropanol Balance

[0056] The preparation method is the same as in Example 1.

[0057] The flux is tested with the Japanese Industrial Standard JISZ 3197-1999, the expansion rate is ≥85%, and the surface insulation resistance value S.I.R is ≥1×10 12 Ω.

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PUM

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Abstract

The invention provides a non-halogen cleaning-free soldering flux, which comprises the following compositions in percentage by weight: 0.5 to 5 percent of stannous oxalate, 0.5 to 20 percent of organic acid activator, 0.1 to 1 percent of surfactant, 0 to 3 percent of cosolvent, and the balance of solvent. Because of adopting the stannous oxalate as an activator, and having synergistic action with the organic acid activator and no halogen, the soldering flux has the advantages of no irritant odour, less smoke, no environmental pollution, strong wetting power and excellent weldability. When the soldering flux is used for welding, a printed package board has less solid residue, clean layout and low ionic contamination, and needs no cleaning after the welding; and the printed package board has high insulation resistance after the welding, which can meet the cleaning-free requirement of the printing package board.

Description

technical field [0001] The present invention relates to flux in electronic materials. Background technique [0002] Flux is the key material to ensure the quality of welding. It should not only have high flux, but also not corrode the material to be welded. At the same time, it must meet a series of mechanical and electrical properties, especially reliability requirements. Therefore, , The quality of flux directly affects the quality of welding products. [0003] In the soldering process, because some halogen-containing chemical substances have excellent soldering activity and low cost advantages, most of the currently used fluxes are composed of rosin, resins, and halide-containing activators. This type of flux can be used Good solderability and low cost, but if the electronic products after welding continue to retain the activity of halogen-containing chemicals, the ion pollution will exceed the standard, and then chronic electrical leakage and corrosion will occur, short...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 朱岳恩丁建设
Owner 宁波喜汉锡焊料有限公司
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