Expanded polypropylene resin beads and foamed molded article thereof

A technology of polypropylene-based resin and expanded particles, which is applied in the field of expanded particle moldings to achieve the effects of reducing clamping pressure, reducing thickness, and reducing energy costs

Active Publication Date: 2010-04-07
JSP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, it is generally believed that by selecting a polypropylene resin with a low melting point, the saturated vapor pressure of the heating water vapor can be reduced during in-mold molding, but there are still technical problems in maintaining heat resistance.

Method used

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  • Expanded polypropylene resin beads and foamed molded article thereof
  • Expanded polypropylene resin beads and foamed molded article thereof
  • Expanded polypropylene resin beads and foamed molded article thereof

Examples

Experimental program
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Effect test

Embodiment

[0066] The present invention will be described in more detail below by way of examples. However, the present invention is not limited to these examples. Evaluation methods and the like in Examples are described below. In addition, the DSC apparatus used in the Example of this invention, and a comparative example is the product of Tei-Ei-Instrument-Japan Co., Ltd., and a brand name: DSC Q1000.

[0067] (1) Evaluation method (1-1) The melting point of the base resin (i) base resin adopts "[1] For the expanded polypropylene-based resin particles as the first aspect, (2) the polypropylene-based resin (a ), (2-3) Polypropylene-based resin including mixed resin (a), (ii) Measurement method of melting point" by the method described in the item. (1-2) For the measurement of the resin melting point of expanded particles (i) expanded particles "[1] For the expanded polypropylene resin particles as the first aspect, (1) expanded polypropylene resin particles ( b), (1-1) The method of ...

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Abstract

The polypropylenic resin foamed particles are provided, which have a melting point of 120[deg.]C or higher and lower than 140[deg.]C, wherein the melting point is determined from a DSC curve determined by heat flux differential scanning calorimetry in accordance with JIS K7121-1987 in which a test piece of 1 to 3 mg of the polypropylene resin foamed particles is heated to 200[deg.]C at a heating rate of 10[deg.]C / min, then cooled to 30[deg.]C at a rate of 10[deg.]C / min, and again heated from 30[deg.]C to 200[deg.]C at a heating rate of 10[deg.]C / min, to determine the DSC curve. The polypropylenic resin foamed praticles have an apparent density ratio [(the apparent density before heated) / (the apparent density after heated)] of not greater than 1.5 when heated for 10 s by saturated steam at a temperature higher by 5[deg.]C than the melting point thereof in a pressure vessel.

Description

technical field [0001] The present invention relates to polypropylene-based resin expanded particles and an expanded particle molded product obtained by in-mold molding. Background technique [0002] Polypropylene-based resins are used in various fields due to their excellent balance of mechanical strength, heat resistance, processability, price, etc., and their excellent properties such as ease of incineration, ease of recycling, and the like. The expanded particle molded product obtained by in-molding expanded polypropylene resin particles can add properties such as cushioning, heat insulation, and light weight without compromising the excellent properties of the above-mentioned polypropylene resin. Widely used in packaging materials, construction materials, impact absorbing materials for vehicles, etc. [0003] Compared with the polystyrene resin expanded particle molded body used for similar purposes, the polypropylene resin expanded particle molded body obtained by in-...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/10C08J9/00
CPCC08J9/18C08J2423/00C08J2203/06C08J9/0061C08J2323/12B29C44/3461C08J9/16C08J9/22C08L23/10
Inventor 及川政春野原德修
Owner JSP CORP
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