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Semiconductor high-pressure single-wall heat-shrinkable tube and preparation method thereof

A shrinking tube, high-voltage technology, applied in the direction of cable joints, etc., to achieve the effect of low longitudinal shrinkage

Active Publication Date: 2010-05-05
JIANGSU DASHENG HEAT SHRINKABLE MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary heat shrinkable tubes can no longer meet these requirements at the same time, which brings us a new topic, that is, it is necessary to develop a heat shrinkable tube that can not only be waterproof and sealed, but also have certain mechanical strength, good electrical properties and chemical properties. A new type of heat shrinkable product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A semi-conductive high-pressure thermal single-wall shrink tube is composed of wall material, wherein the wall material is composed of 90 parts of polyolefin mixed resin, 10 parts of conductive carbon black, and 20 parts of auxiliary agent according to the parts by mass;

[0027] By mass percentage: the polyolefin mixed resin is a polyolefin mixed resin prepared by melt blending four kinds of polyolefin materials: 10-20% EVA630, 10-20% EVA421, 20-30% EVA283 and 30-50% EVA220 ;

[0028] The auxiliary agent is composed of paraffin, antioxidant, anti-copper agent, processing stabilizer and sensitizing cross-linking auxiliary agent; wherein the antioxidant tetrakis (β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid) 1-3 parts of pentaerythritol; anti-copper agent MDA-1024 (hydroxyl-terminated polybutadiene acrylonitrile liquid rubber) 0.5-1 part; processing stabilizer rare earth composite stabilizer (REC-LS-D or REC-LS- F) 0.02-2 parts; 2-4 parts of smoke suppressant zi...

Embodiment 2

[0040] A semi-conductive high-pressure thermal single-wall shrink tube is composed of a wall material. According to the parts by mass, the wall material is composed of 90 parts of polyolefin mixed resin, 10 parts of conductive carbon black and 10 parts of auxiliary agent;

[0041] The polyolefin mixed resin is a polyolefin mixed resin prepared by melt blending four kinds of polyolefin materials of 10% EVA630, 20% EVA421, 25% EVA283 and 45% EVA220 by mass percentage; (β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate) is 1 part of pentaerythritol ester, anti-copper agent is 1 part of hydroxyl-terminated polybutadiene acrylonitrile liquid rubber, rare earth composite stabilizer (REC - 2 parts of LS-D or REC-LS-F), 3 parts of zinc borate as a smoke suppressant, 1 part of trimethylolpropane as a sensitizing cross-linking auxiliary agent, and the balance is paraffin;

[0042] A method for preparing a semiconducting high-pressure thermal single-wall shrink tube,

[0043] A. Preparat...

Embodiment 3

[0053] A semi-conductive high-pressure thermal single-wall shrink tube is composed of a wall material. According to the parts by mass, the wall material is composed of 90 parts of polyolefin mixed resin, 10 parts of conductive carbon black and 10 parts of auxiliary agent;

[0054] The polyolefin mixed resin is a polyolefin mixed resin prepared by melt blending four kinds of polyolefin materials of 30% EVA630, 20% EVA421, 40% EVA283 and 10% EVA220 by mass percentage; (β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate) is 1 part of pentaerythritol ester, anti-copper agent is 1 part of hydroxyl-terminated polybutadiene acrylonitrile liquid rubber, rare earth composite stabilizer (REC - 2 parts of LS-D or REC-LS-F), 3 parts of zinc borate as a smoke suppressant, 1 part of trimethylolpropane as a sensitizing cross-linking auxiliary agent, and the balance is paraffin;

[0055] A method for preparing a semiconducting high-pressure thermal single-wall shrink tube,

[0056] B. Preparat...

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Abstract

The invention relates to a heat-shrinkable tube, in particular to a semiconductor high-pressure single-wall heat-shrinkable tube and a preparation method thereof. The Semiconductor high-pressure single-wall heat-shrinkable tube is prepared from a wall material which comprises the following components in parts by weight: 90 parts of mixed polyolefin resin, 10 parts of conductive carbon black and 10 parts of auxiliary agent. The preparation method comprises the following steps of: the preparation of the wall material of the semiconductor high-pressure single-wall heat-shrinkable tube; extrusion; irradiation; and extending and molding. Compared with conventional shrinkable tubes, the semiconductor high-pressure single-wall heat-shrinkable tube keeps the characteristics of good electrical property, chemical property, and the like of ordinary heat-shrinkable tubes, and has all use properties of the ordinary heat-shrinkable tubes and the properties of water proofing, sealing, damp proofing, and the like.

Description

1. Technical field: [0001] The invention relates to a heat-shrinkable tube, in particular to a semiconducting high-pressure thermal single-wall shrinkable tube and a preparation method thereof. 2. Background technology [0002] From the birth of heat shrinkable products to the present, the development speed can be said to be rapid, and the application field has been continuously expanded. At the beginning of the production of heat shrinkable products, they were mainly used for insulation protection, and now they are widely used in aviation, aerospace, ships, automobiles, home appliances, communications and petroleum. Chemical industry and other fields. Heat-shrinkable products play the role of sealing moisture-proof, waterproof, anti-corrosion and anti-vibration dislocation for cable joints and branches. Therefore, heat-shrinkable tubes are required to have good physical and electrical properties, such as wear resistance, anti-corrosion Impact resistance, high dielectric st...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/08C08L9/02C08K13/02C08K3/04C08K5/01C08K5/134C08K3/38C08K5/053B29C69/02B29C71/04B29B9/00B29C47/92B29C61/02H02G15/18B29C48/92
CPCB29C48/09
Inventor 张志强庄向阳
Owner JIANGSU DASHENG HEAT SHRINKABLE MATERIALS
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