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Base region structure of triode

A transistor and base technology, applied in transistors, electrical components, circuits, etc., can solve problems such as germanium-silicon lattice mismatch, and achieve the effect of improving performance, reducing base resistance, and not easy to lattice adaptation.

Inactive Publication Date: 2010-05-19
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to solve the problem of lattice mismatch between germanium and silicon in the growth of silicon germanium layer or silicon germanium carbon layer on the collector electrode in the prior art, the present invention provides a base electrode without lattice mismatch between germanium and silicon structure

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  • Base region structure of triode

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Embodiment Construction

[0016] Below, the present invention will be further described in conjunction with the accompanying drawings.

[0017] The present invention proposes a triode base region structure, the triode includes an emitter region, a base region and a collector region, and the base region is located between the emitter region and the collector region. Below, please refer to figure 2 , figure 2 It is a schematic diagram of the base structure of a triode according to the present invention. It can be seen from the figure that the base includes an undoped polysilicon layer 31, a silicon germanium layer or a germanium layer formed sequentially from the side of the collector region to the side of the emitter region. A silicon carbon layer 32 and a doped polysilicon layer 33, wherein the non-doped polysilicon layer 31 is connected to the collector region, and the doped polysilicon layer 33 is connected to the emitter region. The thickness range of the undoped polysilicon layer is 0.1 nanomet...

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Abstract

The invention provides a base region structure of a triode. The triode comprises an emitter region, a base region and a collector region, wherein the base region is positioned between the emitter region and the collector region, and comprises an undoped polycrystalline silicon layer, a germanium-silicon layer or germanium-silicon carbon layer and a doped polycrystalline silicon layer which are formed in turn from one side of the collector region to one side of the emitter region; the undoped polycrystalline silicon layer is connected with the collector region; and the doped polycrystalline silicon layer is connected with the emitter region. In the base region structure of the triode, a layer of the undoped polycrystalline silicon layer is deposited between the germanium-silicon layer or the germanium-silicon carbon layer and the collector region of the base region so that the problem of lattice mismatch between germanium and silicon caused by growing the germanium-silicon layer or the germanium-silicon carbon layer on a collector electrode is solved, which is in favor of alignment operations of a subsequent photolithographic process.

Description

technical field [0001] The invention relates to the technical field of integrated circuit manufacturing technology, in particular to a triode base region structure. Background technique [0002] The transistor is one of the most commonly used basic components. The function of the transistor is mainly to amplify the current. It is the core component of the electronic circuit. The basic component of the large-scale integrated circuit is the transistor. [0003] The basic structure of the triode is as follows figure 1 As shown, two PN junctions that are very close to each other are made on a semiconductor substrate. The two PN junctions divide the positive semiconductor into three parts. The middle part is the base region 12, and the two sides are the emitter region 11 and the collector region 13. , There are two kinds of arrangements, PNP and NPN, and the corresponding electrodes are drawn from the three regions, which are base b, emitter e and collector c. The PN junction b...

Claims

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Application Information

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IPC IPC(8): H01L29/73H01L29/10H01L21/331
Inventor 朱骏
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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