Method for cleaning copper or copper alloy sputtering target material

A technology for sputtering target materials and copper alloys, applied in liquid cleaning methods, cleaning methods and utensils, sputtering coating, etc., which can solve problems such as increased cleaning agent usage, reduced cleaning efficiency, and increased cleaning agent costs , to achieve the effect of ensuring cleaning efficiency, good cleaning effect and reducing cost
CN101724818AActive Publication Date: 2010-06-09KONFOONG MATERIALS INTERNATIONAL CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
KONFOONG MATERIALS INTERNATIONAL CO LTD
Publication Date
2010-06-09

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Abstract

The invention provides a method for cleaning a copper or copper alloy sputtering target material, which has at least two cleaning phases. In the first cleaning phase, a copper or copper alloy sputtering target material is cleaned at least once with a first cleaning agent solution; and in the second cleaning phase, the copper or copper alloy sputtering target material is cleaned at least once with a second cleaning agent solution. The first cleaning agent and the second cleaning agent are different and are independent water, organic solvents and any one of mixtures of a plurality of solvents respectively. In addition, the cleaning method can also comprises a preheating procedure before the first cleaning phase and a steam cleaning phase after the second cleaning phase. The invention can comprehensively remove oil contamination, dust, impurities, and the like fully, reduce the cleaning cost and obtain more favorable cleaning effect.
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Description

technical field

[0001] The invention provides a cleaning method for a sputtering target, in particular to a cleaning method for a copper or copper alloy sputtering target. Background technique

[0002] In recent years, semiconductor technology has developed rapidly. With the miniaturization and miniaturization of semiconductor devices, the requirements for the size and quality of the coating film formed on the semiconductor chip are also getting higher and higher. As we all know, among the various coating methods currently used, due to the different film-forming principles, sputter coating is better than other coatings. For example, the coating formed by sputter coating is more uniform, strong and excellent in performance. However, compared with other coating methods, sputter coating also has very high requirements on the cleanliness of the raw material, that is, the target. The principle of sputtering coating is to bombard the target with accelerated ions, so that the comp...

Claims

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