Method for cleaning copper or copper alloy sputtering target material

Abstract

The invention provides a method for cleaning a copper or copper alloy sputtering target material, which has at least two cleaning phases. In the first cleaning phase, a copper or copper alloy sputtering target material is cleaned at least once with a first cleaning agent solution; and in the second cleaning phase, the copper or copper alloy sputtering target material is cleaned at least once with a second cleaning agent solution. The first cleaning agent and the second cleaning agent are different and are independent water, organic solvents and any one of mixtures of a plurality of solvents respectively. In addition, the cleaning method can also comprises a preheating procedure before the first cleaning phase and a steam cleaning phase after the second cleaning phase. The invention can comprehensively remove oil contamination, dust, impurities, and the like fully, reduce the cleaning cost and obtain more favorable cleaning effect.

Description

technical field [0001] The invention provides a cleaning method for a sputtering target, in particular to a cleaning method for a copper or copper alloy sputtering target. Background technique [0002] In recent years, semiconductor technology has developed rapidly. With the miniaturization and miniaturization of semiconductor devices, the requirements for the size and quality of the coating film formed on the semiconductor chip are also getting higher and higher. As we all know, among the various coating methods currently used, due to the different film-forming principles, sputter coating is better than other coatings. For example, the coating formed by sputter coating is more uniform, strong and excellent in performance. However, compared with other coating methods, sputter coating also has very high requirements on the cleanliness of the raw material, that is, the target. The principle of sputtering coating is to bombard the target with accelerated ions, so that the comp...

AI Technical Summary

Problems solved by technology

However, increasing the replacement frequency of the cleaning agent will increase the amount of cleaning agent used, resulting in an increase in the cost of the cleaning agent used, and the cleaning operation is forced to stop during the replacement of the cleaning agent, resulting in a decline in cleaning efficiency

[0006] In the case of multi-tank cleaning, compared with the case of single-tank cleaning, the replacement frequency of cleaning agents can be reduced and the cleaning efficiency can be improved. Oil stains, dust and other impurities on the material, the cleaning effect is not good

[0007] In addition, since the surface of copper or copper alloy sputtering targets is more prone to rust, the surface of rusted copper or copper alloy sputtering targets will also adversely affect the film quality of sputtering coatings.

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