Circle substrate firing furnace

A sintering furnace, circulation technology, applied in the direction of furnace, furnace type, lighting and heating equipment, etc., can solve the problems of loss of sintering temperature stability of sintering furnace, reproducibility of sintering treatment, etc. Low efficiency, reduced heat loss, and easy temperature control
CN101749949AInactive Publication Date: 2010-06-23FUTURE VISION
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
FUTURE VISION
Publication Date
2010-06-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention provides a circle substrate firing furnace which can reduce the heat loss and obtain the steady sintering temperature. The sintering treatment of a glass substrate (W) can be performed by blowing out the hot blast from a furnace main body part (10). the hot blast exhausted from the furnace main body part (10) cycles in a circulating path (20) by a circulating fan (40), passes through an adsorption tower (30) for adsorbing and decomposing the resultant from a catalyst filtering part (70) for decomposing the organic compounds, and is heated again in a main heater (52). The hot blast exhausted from the furnace main body part (10) directly flows into the catalyst filtering part (70), thereby the organic compounds contained in the hot blast can be decomposed, thus no additional single heater is needed for heating the catalyst, the heat loss can be reduced. In addition, the sintering temperature in the furnace main body part (10) can be adjusted by controlling the main heater (52), therefore the temperature can be easily controlled to obtain the steady sintering temperature.
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Description

technical field

[0001] The present invention relates to a circulation type substrate firing furnace which heats a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), and a semiconductor wafer while circulating hot air. Substrates for thin plate-shaped electronic components (hereinafter referred to simply as "substrates") are subjected to firing treatment. Background technique

[0002] As one of the manufacturing steps of a color filter, there is a step of firing a glass substrate to which a color ink is adhered by inkjet. This firing step is performed by holding the glass substrate in an air atmosphere for a predetermined time in a firing furnace heated up to a predetermined firing temperature. In addition, when forming metal wiring on a glass substrate, the glass substrate is fired in an inert gas atmosphere such as nitrogen in the same firing furnace. In all firing processes, since the organic solvent contained in the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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