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Method for preparing ultrathin diamond carbon film

A technology of diamond-like film and diamond, which is applied in the field of preparation of ultra-thin diamond-like carbon film, can solve the problems that it is difficult to prepare a continuous and dense protective film, limit the application of the protective layer, and the effect is not significant, and achieve excellent friction and wear characteristics. Effect of stress reduction and wear life improvement

Inactive Publication Date: 2010-07-07
LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the diamond-like carbon film has a significant defect in the protection of the hard disk head and disk surface, that is, the bonding force between the diamond-like film and the magnetic head and the disk surface is poor. With the increase of the magnetic storage density and the decrease of the flying height of the magnetic head, protection The thickness of the film is getting thinner and thinner, which urgently needs to solve the problem of the bonding force between the diamond-like film and the magnetic head and disk surface
At present, the existing technology to solve the bonding force between the diamond-like film and the magnetic head and the disk is to deposit a layer of single-atom Si layer before depositing the diamond-like film, but this method is not effective in improving the bonding force of the film base.
In addition, the self-assembled organic monomolecular film, which is currently a research hotspot, has a big defect as an anti-wear and anti-friction protective film for micro-nano devices: it is difficult to prepare a continuous and dense protective film, which limits its use as a protective layer in actual production. application in

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0016] Select organic self-assembled monomolecular N'-[3-(Trimethoxysilyl)-propyl]driethylenetriamine, tech(TA) as the organic transition layer and P(100)Si as the substrate. First put the substrate in a 60% concentration Boil in sulfuric acid for 30 minutes. Then mix acetone and water into a solvent at a volume ratio of 5:1, and the solute is N'-[3-(Trimethoxysilyl)-propyl]driethylenetriamine, tech(TA). Put the boiled Si substrate into the solvent and solution ( TA) is soaked in the 2-3mmol / L solution. Then, an RF-PECVD equipment is used to deposit diamond-like carbon films on P(100)Si substrates and P(100) silicon substrates prepared with organic self-assembled monolayers. Methane (10.3sccm) and hydrogen (20sccm) were introduced and deposited for 4 minutes under the conditions of radio frequency power of 100W, negative bias voltage of 200V, and deposition pressure of 5 Pa. The thickness of the ultra-thin diamond-like carbon film is about 6nm.

[0017] AFM morphology characte...

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Abstract

The invention discloses a method for preparing an ultrathin diamond carbon film by adopting a self-assembling organic monomolecular film as a modulating layer. By adopting an organic self-assembling monomolecular film as a transition layer, the ultrathin diamond film is prepared. The method has low cost and is easy for operation, and the prepared film has favorable friction and abrasion characteristics.

Description

Technical field [0001] The invention relates to a preparation method for preparing an ultra-thin diamond-like carbon film by using a self-assembled organic monomolecular film as a modulation layer. technical background [0002] Diamond-like carbon (DLC) film has excellent mechanical properties and is a very good protective material. Because of its simple preparation method, it has now been used in many fields. For example, as a protective film between the hard disk head and the disk surface and micro-nano devices. However, the diamond-like carbon film as the protection of the hard disk head and disk surface has a significant defect, that is, the bonding force between the diamond-like carbon film and the magnetic head and the disk surface is poor. As the magnetic storage density increases and the flying height of the magnetic head decreases, protection is required. The thickness of the film is getting thinner and thinner, which urgently needs to solve the problem of the bonding ...

Claims

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Application Information

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IPC IPC(8): C04B41/50
Inventor 张俊彦王琦张军英
Owner LANZHOU INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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