Ink and method adopting ink to prepare conductive line

Abstract

The invention discloses an ink, which comprises CNT dispersion. The CNT dispersion comprises solvent and CNTs dispersed in the solvent wherein the ink further comprises precious metal ions and a coupling agent. The precious metal ions adhere to the surface of the CNTs through the coupling agent. The invention also relates to a method preparing the conductive line. The method comprises the following steps: the ink is provided, the ink comprises the solvent, the CNTs dispersed in the solvent evenly, the precious metal ions and the coupling agent, the precious metal ions adhere to the surface of the CNTs through the coupling agent, a conductive line prefabricated body comprising the CNTs and the precious metal ions is formed on a basement surface, the precious metal ions in the conductive line prefabricated body are restored to precious meta particles and the conductive line prefabricated body comprising the precious meta particles and the CNTs is metalized.

Description

technical field [0001] The invention relates to an ink and a method for preparing a conductive circuit using the ink, in particular to an ink based on carbon nanotubes and a method for preparing a conductive circuit using the ink. Background technique [0002] In recent years, information, communication, and consumer electronics have gradually become the fastest growing industries in the world. In the information, communication and consumer electronics industries, printed circuit boards are an indispensable and important component. Printed circuit board (PCB) is the support of electronic components and the provider of circuit connections for electronic components. Because it is made using electronic printing techniques, it is called a "printed" circuit board. [0003] Traditional printed circuit boards are mostly manufactured by screen printing. The general process of manufacturing printed circuit boards includes pressing the metal film on the surface of the substrate, and...

AI Technical Summary

Problems solved by technology

However, the method has the following disadvantages: first, the method needs to use ink with a reducing agent to reduce the silver ions in the silver salt to the silver salt through chemical reaction

Make this preparation method process complicated, and cost is higher

Second, the circuit prepared by this method is composed of interconnected silver particles formed by the reduction of silver ions, and the distribution of silver particles reduced by silver ions is not uniform enough, so the thickness of the conductive circuit formed is not uniform enough, and its conductivity is poor.

However, the dispersant is not easy to remove, resulting in the existence of a large amount of dispersant in the conductive base formed by carbon nanotubes, so that the conductivity of the conductive base is not uniform, so that the metal layer obtained by electroplating everywhere on the conductive base during the electroplating process Non-uniform thickness, resulting in poor conductivity of the wire obtained by this method

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