Process module facility

A technology of process modules and facilities, applied in metal material coating process, ion implantation plating, gaseous chemical plating, etc., can solve the problems of the bottleneck of the second film layer, difficulty in large substrate transmission and use, complex mechanical design, etc.
CN101770934AActive Publication Date: 2010-07-07ARCHERS
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
ARCHERS
Publication Date
2010-07-07

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Abstract

In accordance with some embodiments described herein, a process module facility is provided, comprising: at least one process chamber carried in frame, a subfloor adjacent the process module, a stationary pump and electrical box positioned atop the subfloor; and gas control lines and vacuum exhaust lines housed within the subfloor and coupled the process chamber. The process module facility may be integrated with a larger system for processing substrates which includes two or more process module facilities, a substrate handling robot, a load lock chamber, and a transverse substrate handler. The transverse substrate handler includes mobile transverse chambers configured to convey substrates to process modules, wherein each mobile transverse chamber is configured to maintain a specified gas condition during the conveyance of the substrates. The transverse substrate handler further includes a rail for supporting the mobile transverse chambers, wherein the rail is positioned adjacent to entry of the process modules, and drive systems for moving the mobile transverse chambers on the rail.
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Description

technical field

[0001] Embodiments described herein relate generally to a system and method for processing substrates such as but not limited to glass and other substrates used in the solar or photovoltaics (PV) industries, and Wafers used in the semiconductor industry. And the described embodiments of the present invention are particularly related to a system and method including one or more mobile transverse chambers for transferring substrates between process modules. Background technique

[0002] The manufacture of semiconductor elements, flat display panels, and photovoltaic or solar cells requires multiple processes, such as etching, chemical vapor deposition (CVD), sputtering, and cleaning, on various substrates to produce predetermined device or product. These processes may each perform a single process step by a single and individual process tool or module. Since multiple process steps must be performed, the substrate must be transferred from one process tool to ...

Claims

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