Solder ball implanting method and solder ball implanting system applying solder ball implanting method

Abstract

The invention relates to a solder ball implanting method and a solder ball implanting system applying the solder ball implanting method. The solder ball implanting method comprises the following steps: after solder balls are implanted onto a flux laid on a substrate sheet, applying an external vibration force with a preset strength to the substrate sheet so that the solder balls which cannot be hinged to ball pads on the substrate sheet are hinged back into open holes of the ball pads under the action of the external vibration force, wherein the open holes are formed from a solder mask covered on the substrate sheet and are used for the substrate sheet to be exposed; and then carrying out reflow operation to complete the solder ball implanting process on the substrate sheet. As the solder balls can be hinged to the ball pads on the substrate sheet by the method of the invention, the problem of missing balls can be effectively solved to avoid the rework requirement and the reliability of the finished product can be provided. The invention also provides the solder ball implanting system applying the solder ball implanting method.

Description

technical field [0001] The present invention relates to a ball implantation method and a ball implantation system applying the ball implantation method, in particular to a ball implantation method for implanting solder balls on a ball pad of a substrate and a ball implantation method using the ball implantation method system. Background technique [0002] In order to reduce the packaging cost and increase the output per unit time, under applicable conditions, the packaging industry generally uses a substrate plate (Substrate Plate) with a plurality of substrate units (SubstrateUnit) arranged in an array, and then semiconductor chips After being connected and electrically connected to the corresponding substrate unit on the substrate, the molding operation (Molding Process) is carried out to form a whole piece (two or three pieces can be used) on the top surface of the substrate with the semiconductor chip connected. )-type encapsulant (Encapulant or Mold body) to cover the ...

AI Technical Summary

Problems solved by technology

Therefore, when the two sides 10a, 10b of the substrate sheet 12 along the length direction warp to become the substrate sheet 13, the ball pads 11 at the two sides 15a, 15b where the warping phenomenon occurs will deviate from the predetermined position of the ball pads 11, as Figure 1B As shown by the midlines 16a and 16b of the predetermined positions of the ball pads, the injection location of the flux and the implantation location of the solder balls remain unchanged and will not be adjusted accordingly, so it will result in Figure 2B The shown solder flux 21 is laid on the corresponding ball pad 204 of the substrate and the solder ball 22 is implanted on the corresponding solder flux 21, which will deviate from the predetermined position, that is to say, the solder flux 21 and the solder ball 22 will be as follows Figure 2C As shown, it will deviate from the center position of the ball pad 204, and the solder ball 22 will not be aligned to the ball pad 204. In this way, after the reflow operation (Reflow) is completed, the solder ball 22 will not be covered by enough flux 21. Trapped, it is easy to cause the problem of solder ball drop in the completed semiconductor package, which affects the yield of finished products

Images