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Organic electroluminescence device

An electroluminescent device, organic technology, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of easy falling off, device pollution, metal deformation, etc., to expand the selection range, overcome poor adhesion, and solve easy peeling. Effect

Inactive Publication Date: 2010-07-07
TSINGHUA UNIV +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, in order to better conduct with the electrode, the width of the metal mounting area is wider than that of the other parts of the lead. This design can effectively increase the area of ​​the electrode and its lead and improve the conduction effect. However, many times in production The baking process will cause metal deformation
For the insulating layer with poor adhesion to the metal, it is easy to fall off and cause pollution to the device

Method used

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  • Organic electroluminescence device
  • Organic electroluminescence device
  • Organic electroluminescence device

Examples

Experimental program
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Effect test

Embodiment 1

[0035] refer to image 3 . The organic electroluminescent device in this embodiment includes a substrate, an anode strip, an organic functional layer, and a cathode strip. The substrate is divided into a light-emitting area and a lead area, and a metal mounting area where the cathode strip and its lead are overlapped is set between the light-emitting area and the lead area. The embodiment is that odd-numbered rows and even-numbered rows of metal mounting areas are separately set up on the left and right sides of the screen body, refer to Figure 3-a , just take the metal mounting area on the right as an example. The insulating layer is located in even-numbered rows such as 4, 6, and 8. On the layer (ITO), the pattern on the right edge of the insulating layer forms a comb-like shape. The loading positions of even-numbered rows such as 4, 6, and 8 are the conductive layer (ITO), the low-resistance metal layer (chromium or molybdenum or molybdenum-aluminum-molybdenum), and the ...

Embodiment 2

[0037] refer to Figure 4 . The organic electroluminescent device in this embodiment includes a substrate, an anode strip, an organic functional layer, and a cathode strip. The substrate is divided into a light-emitting area and a lead area, and a metal mounting area where the cathode strip and its lead are overlapped is set between the light-emitting area and the lead area. The embodiment is that odd-numbered rows and even-numbered rows of metal mounting areas are separately set up on the left and right sides of the screen body, refer to Figure 3-a , only take the metal mounting area on the right as an example, and the insulating layer pattern refers to Figure 3-a ,and Figure 1-b The pattern is the same, the area located above the low-resistance metal rectangular layer, the insulating layer is ring-shaped, and the middle through hole is the real overlapping area between the cathode and the low-resistance metal. Figure 3-b It is a low-resistance metal layer pattern, whi...

Embodiment 3

[0039] refer to Figure 4 . The organic electroluminescent device in this embodiment includes a substrate, an anode strip, an organic functional layer, and a cathode strip. The substrate is divided into a light-emitting area and a lead area, and a metal mounting area where the cathode strip and its lead are overlapped is set between the light-emitting area and the lead area. The embodiment is that odd-numbered rows and even-numbered rows of metal mounting areas are separately set up on the left and right sides of the screen body, refer to Figure 4-a , only take the metal mounting area on the right as an example, and the insulating layer pattern refers to Figure 3-a ,and Figure 1-b The pattern is the same, the area located above the low-resistance metal rectangular layer, the insulating layer is ring-shaped, and the middle through hole is the real overlapping area between the cathode and the low-resistance metal. Figure 4-b It is a low-resistance metal layer pattern, and...

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Abstract

The invention discloses an organic electroluminescence device, comprising a base plate, an anode strap, an organic functional layer and a cathode strap; a luminous zone and a leading wire zone are divided on the base plate, and the a cathode strap and a metal carrying zone lap-jointed with the leading wire are arranged between the luminous zone and the leading wire zone; the organic electroluminescence device is characterized in that: the insulating layer of the metal carrying zone is contacted with a conducting layer; in the invention, the leading wire and an electrode strap carrying zone are designed that the insulation layer is contacted with the conducting layer ITO, so as to overcome the disadvantage of poor adhesiveness between the insulation layer and low-resistance metal and solve the problem that the insulation layer is easy to be peeled off under the condition of not affecting the lead wire resistance; the requirement of the adhesiveness to the insulation layer material can be reduced properly, and the selection range of the insulation layer material is expanded.

Description

technical field [0001] The invention relates to an organic electroluminescent device, in particular to an organic electroluminescent device with an improved metal carrying area. Background technique [0002] Currently, liquid crystal, plasma, and organic electroluminescent devices are mainly used in the field of flat panel display, among which organic electroluminescent devices are gradually becoming mature and becoming a new generation of flat panel display technology. [0003] refer to figure 1 , which is the plane structure diagram of the organic electroluminescent device screen body, the row electrode is overlapped with the electrode lead 6 in the metal carrying area B between the light emitting area A and the lead area C, and the row electrode is led out to the binding area by the electrode lead 1 D, bind with the driver chip. The structure of the existing metal loading area B is: a conductive layer placed on the glass substrate 1, generally ITO, and a low-resistance ...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/50H01L51/52
Inventor 邱勇彭兆基张明吴伟力辛小刚陈剑雄吴贵斌
Owner TSINGHUA UNIV
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