Power converter

A power conversion device and power conversion technology, which is applied in the modification of power consumption devices, control devices, power electronics, etc., can solve problems such as semiconductor loss, and achieve the effect of reducing and suppressing thermal effects.

Active Publication Date: 2010-07-14
HITACHI ASTEMO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In addition, the heat generation of the semiconductor chip is also caused by the loss during the switching operation of the semiconductor.

Method used

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Embodiment 2

[0083] Below, refer to Figure 9 , and describe the second embodiment of the present invention.

[0084] This embodiment is an improved example of the first embodiment, and the same components are assigned the same symbols, and will not be described again.

[0085] The difference between this embodiment and the first embodiment is that a third cooling cavity surrounded by the upper casing 10 and the second upper casing 19 is formed on the upper part of the cooling cavity containing the semiconductor modules 20 and 30, and the drive circuit A substrate 97 including a substrate, a control circuit substrate, and a connector substrate is accommodated therein.

[0086] The wiring sheets of the semiconductor modules 20 and 30 and the substrate 97 are electrically connected by a wiring member 98 .

[0087] The capacitor case of the capacitor 50 is omitted and replaced by pi-shaped legs of the second base 12 . Therefore, the π-shaped legs of the second base 12 are formed to extend ...

Embodiment 3

[0091] Below, refer to Figure 10 , and describe the third embodiment of the present invention.

[0092] This embodiment is an improved example of the first embodiment, and the same components are assigned the same symbols, and will not be described again.

[0093] The difference between the present embodiment and the first embodiment is that the drive circuit boards 70, 71, the AC bus bar 60, and the terminal bracket 63 are housed together in the cooling chamber for housing the semiconductor modules 20, 30.

[0094]In addition, below the cooling chamber for storing the semiconductor modules 20 and 30 , a second cooling chamber is formed by the second base 12 , and further, two third cooling chambers are formed by the second base 12 therebelow. The capacitor 50 is housed in the second cooling chamber; the control circuit board 74 is housed in one of the third cooling chambers; and the connector board 72 is housed in the other third cooling chamber. The capacitor 50 is horizo...

Embodiment 4

[0098] Below, refer to Figure 11 and Figure 12 , and describe the fourth embodiment of the present invention.

[0099] This embodiment is an improved example of the first embodiment, and the same components are assigned the same symbols, and will not be described again.

[0100] The difference between this embodiment and the first embodiment is that the rear wheels 201 are also driven by the motor generator 160 . Therefore, in this embodiment, a set of inverter devices 150 is provided. The power of the motor generator 160 is decelerated by the speed reducer 204 , then transmitted to the rear wheel differential gear 203 , and then transmitted to the rear wheel axle 202 by the rear wheel differential gear 203 . That is, in this embodiment, a four-wheel drive type hybrid vehicle is configured. Inverter device 150 is connected to battery 106 . When motor generator 160 is used as a motor, power is supplied from battery 106 to inverter device 150 ; when motor generator 160 is...

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PUM

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Abstract

A power converter in which the thermal influence of the semiconductor modules (20, 30) on the constituent components other than the semiconductor modules is mitigated. The power converter comprises semiconductor modules (20, 30) constituting the main circuit for power conversion, a capacitor (50) electrically connected to the main circuit drive circuit boards (70, 71) each having a drive circuit for supplying a drive signal for operating power conversion to the main circuit, a control circuit board (74) having a control circuit for supplying the control signal for supplying the drive signal to the drive circuits, and a casing containing the above components. In the casing, a cooling chamber having a coolant passage (28) and a peripheral wall defining the chamber and composed of a heat-conductive member is provided. At least the semiconductor modules (20, 30) are contained in the cooling chamber, and at least the capacitor (50) and the control circuit board (74) are installed outside the cooling chamber.

Description

[0001] This application is a divisional application of the application with the same name whose application number is 200780002520.4 (application date: 2007.1.17). technical field [0002] The present invention relates to a power conversion device that converts input power into predetermined power and outputs it. Background technique [0003] As a background art related to a power conversion device, for example, an inverter device disclosed in Patent Document 1 is widely known. Patent Document 1 discloses a technology for realizing miniaturization of the converter, which uses a base as a medium to stack and arrange switching elements, power modules, smoothing capacitors, and control components in a casing in this order. [0004] Patent Document 1 specifically describes a braking force control technique. [0005] Patent Document 1: JP Unexamined Publication No. 2003-199363 [0006] In recent years, further cost reductions have been demanded for power conversion devices that...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/48B60L50/16
CPCH02M7/003H05K7/20927H05K7/2089H05K7/20872B60L3/003B60L15/007B60L15/20B60L2210/10B60L2210/30B60L2210/40B60L2220/14B60L2220/42B60L2240/12B60L2240/36B60L2240/421B60L2240/441B60L2240/525B60L2260/26B60L2260/28Y02T90/16B60L50/61B60L50/16Y02T10/62Y02T10/64Y02T10/70Y02T10/72Y02T10/7072H01L2224/49175H01L2924/19107H01L2224/48139
Inventor 中津欣也中村卓义斋藤隆一须贺卓船户祐树
Owner HITACHI ASTEMO LTD
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