Mold release film

A release film and release layer technology, which is used in film/sheet adhesives, synthetic resin layered products, chemical instruments and methods, etc. The problem of large quantity and high cost of raw materials

Inactive Publication Date: 2010-07-14
SUMITOMO BAKELITE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As one type of release film for FPC production, there is a release film using a cyclic polyolefin for the release layer, but the release film of the cyclic olefin monomer has poor embedding properties, that is, there is adhesive agent bleeding. Disadvantages of high output and high cost of raw materials

Method used

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  • Mold release film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～22 and comparative example 1～13

[0061] (preparation of samples)

[0062] In Example 1, the release layer resin having the composition shown in Table 1 was supplied to one extruder, and extruded from a single-layer die (300° C.) to form a release single-layer film of a predetermined thickness. In addition, in Example 2, the polymers of the respective compositions shown in Table 1 were supplied to two extruders as the release layer resin and the buffer layer resin, and they were co-extruded from a double-layer die (300° C.) to obtain Release multilayer film of specified thickness.

[0063] In Examples 3 to 22 and Comparative Examples 1 to 13, the polymers of the compositions shown in Table 1 as the release layer resin, buffer layer resin, and release layer resin were supplied to three extruders, and the three-layer die head (300°C) co-extrusion to make a release multilayer film of specified thickness. In addition, in Examples 20 to 22, surface processing was performed by off-line embossing (Ofline Emboss) us...

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Abstract

Disclosed is a practical mold release film which has excellent embeddability, while maintaining excellent properties of a mold release film using a syndiotactic polystyrene. Specifically disclosed is a mold release film having a mold release layer containing a syndiotactic polystyrene and a hydrogenated styrene thermoplastic elastomer. This mold release film is characterized in that the blending ratio of the hydrogenated styrene thermoplastic elastomer relative to the entire resin of the mold release layer is within the range of 15-35 wt%. The hydrogenated styrene thermoplastic elastomer is preferably (i) a styrene-ethylene-butylene-styrene block copolymer or (ii) a styrene-ethylene-propylene-styrene block copolymer. The mold release layer may further contain a cyclic polyolefin resin.

Description

technical field [0001] This invention relates to the release film used for the manufacturing process of a flexible printed circuit board. Background technique [0002] A flexible printed wiring board (hereinafter, sometimes referred to as "FPC") is composed of a flexible circuit member in which a predetermined circuit is provided on the surface of an insulating base material such as a polyimide film. When manufacturing this kind of FPC, usually, the flexible circuit part is covered with a heat-resistant resin film with an adhesive, that is, a cover layer, for insulation and circuit protection. pressing process). [0003] When manufacturing such an FPC, various characteristics are required for the release film. For example, the following characteristics are required: (1) After hot pressing, the release film is easily peeled from the wiring board (release property); (2) The release films bonded to each other on the outer periphery of the wiring board are easily peeled off. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B32B27/30C08L25/06C08L53/00H05K3/00C09J7/02
CPCC08L25/06C08L45/00C08J5/18C09J2453/005C08L53/025C08J2325/06H05K3/281C08L2205/03C09J2425/005C09J7/0228C09J7/401C08L2666/24C08L2666/02B32B27/08
Inventor 八束太一
Owner SUMITOMO BAKELITE CO LTD
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