Portal type silicon chip transfer mechanism

A gantry-type, silicon wafer technology, applied in conveyor objects, sustainable manufacturing/processing, electrical components, etc., can solve the problems of wasting human resources, low efficiency in taking wafers, and high labor intensity, reducing production costs and overcoming manual labor. Operation, the effect of improving transfer efficiency

Active Publication Date: 2010-07-28
WUXI LEAD INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantages of this operation are: it is inconvenient to take the wafers, it is easy to cause the silicon wafers to drop, bruise, and the damage rate of the silicon wafers is high; Production steps; manual operation is labor-intensive, which wastes human resources and the quality of silicon wafer transfer is uneven due to the different proficiency of workers

Method used

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  • Portal type silicon chip transfer mechanism
  • Portal type silicon chip transfer mechanism
  • Portal type silicon chip transfer mechanism

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0015] As shown in the figure, the present invention is mainly made up of frame 1 and the conveying platform installed on frame 1, lifting device and mobile sucker device. A table panel 2 is fixed on the frame 1, and a gantry frame 26 is installed on the table panel 2; It is used to transport and position the silicon wafer box 16 and the quartz frame 27; the lifting device is installed on the gantry 26, and the lifting device is provided with a lifting seat 22, and the mobile suction cup device is installed on the lifting seat 22, and the lifting device is used to drive the mobile suction cup device up and down Lifting; the mobile sucker device is provided with a chip sucker 18, which can control the lateral movement of the chip sucker 18, and the chip sucker 18 is used to suck the silicon wafer 17 in the silicon wafer box 16 and transfer the sucked silicon waf...

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PUM

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Abstract

The invention relates to a portal type silicon chip transfer mechanism, which comprises a stand, and a conveying table, a lifting device and a movable suction disk device which are arranged on the stand. A tabletop board is fixed on the stand and is provided with a portal frame; the conveying table is arranged on the tabletop board and comprises a left conveying device and a right conveying device which are respectively used for transporting and positioning a silicon chip box and a quartz frame; the lifting device is arranged on the portal frame and is provided with a lifting seat; the movable suction disk device is arranged on the lifting seat; the lifting device is used for driving the movable suction disk device to vertically lift; the movable suction disk device is provided with a sheet-type suction disk; the movable suction disk device can control the transverse motion of the sheet-type suction disk; and the sheet-type suction disk is used for absorbing the silicon chip in the silicon chip box and transferring the absorbed silicon chip to the quartz frame. The invention has the advantages of simple, ingenious and reasonable structure, high degree of automation, as well as high transfer efficiency and low damage rate of the silicon chips.

Description

technical field [0001] The invention belongs to the technical field of solar silicon wafer production, and relates to a device for smoothly transferring silicon wafers in a silicon wafer box to a quartz frame to cooperate with the circulation of silicon wafers during the processing and production process, specifically a gantry type silicon wafer transfer agency. Background technique [0002] During the production process of solar silicon wafers, the silicon wafers placed in the silicon wafer box need to be transferred to the quartz frame, and then transported out by the conveying mechanism to cooperate with the subsequent production steps. In the prior art, this operation is usually a manual operation, that is, the staff uses a simple suction cup to suck the silicon wafer, and then transfers the sucked silicon wafer into the quartz frame. The disadvantages of this operation are: it is inconvenient to take the wafers, it is easy to cause the silicon wafers to drop, bruise, a...

Claims

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Application Information

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IPC IPC(8): H01L21/677H01L31/18
CPCY02P70/50
Inventor 王燕清
Owner WUXI LEAD INTELLIGENT EQUIP CO LTD
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