Unlock instant, AI-driven research and patent intelligence for your innovation.

Light emitting diode packaging structure

A technology of light-emitting diodes and packaging structures, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem of glue overflow on the surface of the package shell, and achieve the effect of avoiding glue overflow pollution

Inactive Publication Date: 2010-08-18
EVERLIGHT ELECTRONICS
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The invention provides a light-emitting diode packaging structure, which is used to solve the problem of overflowing glue on the surface of the packaging shell

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Light emitting diode packaging structure
  • Light emitting diode packaging structure
  • Light emitting diode packaging structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0021] figure 2 It is a schematic cross-sectional view of a light emitting diode packaging structure according to an embodiment of the present invention. Please refer to figure 2 , in this embodiment, the LED package structure 100 includes a carrier 110 , a packaging case 120 , a LED chip 130 , a packaging compound 140 and a surface treatment layer 150 . In particular, the LED packaging structure 100 of this embodiment is a surface mount device (SMD) LED packaging structure 100 .

[0022] In detail, the package case 120 is disposed on the carrier 110, and the package case 120 has an upper surface 122, wherein the package case 120 and the carrier 110 form a chip accommodating cavity C′, and the carrier 110 and the carrier 110 The packaging case 120 is an integrally formed structure. In this embodiment, the carrier 110 is, for example, a circuit board. In other embodiments, the carrier 110 may also be a lead frame. In other words, figure 2 The shown carrier 110 is only f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a light emitting diode packaging structure which comprises a bearer, a packaging shell, a light emitting diode chip, a packaging colloid and a surface processing layer. The packaging shell is configured on the bearer and provided with an upper surface, wherein the packaging shell and the bearer form a chip containing recess. The light emitting diode chip is configured on the bearer and positioned in the chip containing recess. The packaging colloid is configured in the chip containing recess and covers the light emitting diode chip. The surface processing layer is configured on the upper surface of the packaging shell and used for preventing the packaging colloid from being attached on the upper surface of the packaging shell.

Description

technical field [0001] The present invention relates to a semiconductor package structure, and in particular to a light emitting diode package structure. Background technique [0002] Light-emitting diodes have advantages such as long life, small size, high shock resistance, low heat generation, and low power consumption, so they have been widely used as indicators or light sources in households and various equipment. In recent years, light-emitting diodes have developed towards multi-color and high brightness, so their application fields have been extended to large outdoor signage, traffic lights and related fields. In the future, light-emitting diodes may even become the main lighting source with both power saving and environmental protection functions. [0003] figure 1 It is a schematic cross-sectional view of a known LED packaging structure. Please refer to figure 1 The LED packaging structure 10 includes a carrier 12 , a package casing 14 , an LED chip 16 and a mol...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00
Inventor 周彦甫
Owner EVERLIGHT ELECTRONICS