Radio frequency high-power heat pipe radiator
A technology of heat pipe radiator and high-power amplifier, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of high cost and large radiator size, improve heat dissipation performance, and solve the effect of radio frequency grounding
Active Publication Date: 2012-03-21
HEBI TIANHAI ELECTRONICS INFORMATION SYST
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Problems solved by technology
[0006] The technical problem to be solved by the present invention is to introduce the heat pipe technology into the heat sink of the radio frequency high power amplifier and make it meet the radio frequency grounding requirements, so as to provide A heat sink with small volume, high heat dissipation efficiency and low grounding resistance
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[0018] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0019] Heat pipe technology uses the principle of phase change of working fluid to improve heat dissipation efficiency. It has been widely used in various industries and can be used in combination with natural heat dissipation cooling methods. The heat pipe is used for heat dissipation, and the heat dissipation efficiency is high, the radiator is small in size, and the cost is reasonable. However, heat pipe radiators are now mainly used in the PC industry, consumer electronics industry, medical equipment and public mobile communication industries. In the design and application of high-power heat dissipation in these industries, there is generally no requirement for radio frequency grounding, and the close contact between the heat source and the h...
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The invention relates to a radio frequency high-power heat pipe radiator. The radiator comprises a radiating base (1), a radiating fan (2), a heat pipe and a mask (4), wherein the lower surface of the radiating base (1) is provided with a fin (11); the radiating fan (2) is fixed on the lower surface of the radiating base (1); the heat pipe (3) is embedded in the upper surface of the radiating base (1); and the mask (4) is covered on the heat pipe (3). The heat pipe is arranged in the radiating base, and the mask in close contact with a PCB board which is provided with a radio frequency high-power amplifier chip is arranged on the heat pipe, so thermal resistance and grounding resistance between the radio frequency high-power amplifier chip and the radiating base is reduced, radiating areais saved, and radiating efficiency is enhanced.
Description
technical field [0001] The invention belongs to the field of professional wireless communication, and relates to a radiator for base stations and repeater products, in particular to a radiator for radio frequency high-power amplifiers. Background technique [0002] In the field of professional wireless communication, traditional high-power cooling devices generally use pure aluminum or copper. When the heat dissipation power consumption is above 50W, the volume of the heat sink will be very large if only pure aluminum or copper is used for heat dissipation, and the installation space of the host needs to be increased accordingly. In the past, due to the small capacity of communication users, the space in the communication equipment room was relatively ample. With the development of communication technology, the number of professional wireless communication users is increasing day by day, and base station equipment will gradually face the problem of shortage of installation ...
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IPC IPC(8): H05K7/20
Inventor 孙陈梁珏付勇胡亚星
Owner HEBI TIANHAI ELECTRONICS INFORMATION SYST