Laser cutting machine structure

Abstract

The invention provides a laser cutting machine structure, comprising a working platform. The invention is characterized in that the working platform comprises an adsorption working bedplate and an adsorption hopper, wherein the adsorption hopper is buckled on the lower part of the adsorption working bedplate to form an adsorption chamber; the adsorption working bedplate is provided with through holes which are uniformly distributed in arrays along the plate surface and are communicated with the adsorption chamber to lead to the working table surface; and the air blowing adsorption hopper is provided with an exhaust pipe nozzle which is connected with an exhaust fan via a pipeline. The structure ensures high-precision cutting, runs more steadily and reliably, is used more securely and realizes the technical effect of ensuring stability of running of the mechanical systems in the full working area, minimum differentiation of the optical parameters and stability of long-time working of the whole machine.

Description

technical field [0001] The invention relates to a cutting device for large-format high-precision cutting, in particular to a structure of a laser cutting machine. Background technique [0002] Laser cutting is one of the most important application technologies in the laser processing industry. Due to its many characteristics, it has been widely used in industrial sectors such as automobiles, vehicle manufacturing, aviation, chemical industry, light industry, electrical appliances and electronics, petroleum and metallurgy. In recent years, laser cutting technology has developed rapidly, with an annual growth rate of 20% to 30% internationally. Laser processing is the largest project in foreign laser applications, and it is also an important means of transforming traditional industries. It mainly uses kW to 10KW CO2 lasers and 100W to 1000W YAG lasers to realize cutting, welding, drilling, and cutting of various materials. Scoring and heat treatment etc. In the field of lase...

AI Technical Summary

Problems solved by technology

[0003] At present, this kind of laser cutting equipment is used in the cutting of PVC adhesive paper, conductive film and various electronic insulating materials. Due to the softness of such materials, the flatness of the material itself cannot be guaranteed during cutting, resulting in low cutting accuracy. Damaged materials, such as when cutting fonts or graphics of PVC adhesive paper in the advertising industry, usually the PVC adhesive paper and the underlying anti-adhesive layer are cut off as a whole, resulting in damage to the PVC adhesive paper and difficulty in pasting the processed fonts or graphics

Moreover, there are defects and limitations such as the instability of the mechanical system operation, the large difference in optical parameters in the working area, and the instability of the whole machine for a long time.

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