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Active element array substrate and manufacturing method thereof

A technology of active components and array substrates, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, and electric solid-state devices. The effect of sexual potency

Inactive Publication Date: 2010-08-25
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the copper metal is manufactured, copper oxide will be formed on the surface of the copper metal. Since the etching rate of the copper oxide on the copper surface is different from that of copper, it is easy to cause disconnection in the etching manufacturing process.

Method used

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  • Active element array substrate and manufacturing method thereof
  • Active element array substrate and manufacturing method thereof
  • Active element array substrate and manufacturing method thereof

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Embodiment Construction

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Abstract

The embodiment of the invention provides an active element array substrate and a manufacturing method thereof. The active element array substrate is provided with at least one pattern conducting layer; the pattern conducting layer comprises a copper layer; the section of the copper layer in the normal direction parallel to the copper layer consisting of a first trapezoid and a second trapezoid overlapped on the trapezoid; and the angle difference between the base angle of the first trapezoid and the base angle of the second trapezoid is an acute angle between 5 and 30 degrees. Due to the embodiment of the invention, better electrical efficiency can be provided, and the line broken ratio can be effectively improved.

Description

technical field The present invention relates to an active device array substrate (Active Device Array Substrate), in particular to an active device array substrate with a copper conductive layer. Background technique As the size of the thin film transistor liquid crystal display (TFT-LCD) panel becomes larger and larger, it is accompanied by the resistance capacitance (RC) delay effect caused by the resistance of the metal wire not being low enough, thus causing distortion and distortion of the signal during transmission. , which affects the presentation of panel quality. Using a single-layer copper metal with low resistance to form a metal wire can effectively reduce the RC delay effect. However, when the copper metal is manufactured, copper oxide will be formed on the surface of the copper metal. Since the etching rate of the copper oxide on the copper surface layer is different from that of copper, the problem of disconnection is likely to occur during the etching manuf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/48H01L23/525H01L23/535H01L21/768
Inventor 陈柏林林致远林瑜旻林俊男
Owner AU OPTRONICS CORP
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