Method and device for testing tensile strength of axial lead of glass shell diode

Abstract

The invention relates to a method and a device for testing the tensile strength of an axial lead of a glass shell diode, in particular to a method and a device for testing a glass shell diode, belonging to the technical field of electronic element testing and aiming at solving the problem that the controllability of tension and temperature change range can not be simultaneously satisfied in the tensile testing process of the glass shell diode in the prior art. The invention mainly comprises the device and the method for testing the tensile strength of the axial lead of the glass shell diode, wherein the device comprises a hot air source system, an axial lead tension application system and a forward voltage measuring system. The operations of tensile application and removal, current application, voltage measurement, and the like of the axial lead are carried out outside a high-temperature cabinet. A cabinet door of the high-temperature cabinet is unnecessary to be opened in the whole testing process of forward voltage drop of the diode under the tension and temperature control conditions, thereby ensuring the stability of the environmental temperature inside the cabinet, not influencing the environmental temperature (150 DEG C) of the diode and satisfying the requirements that the environmental temperature of the diode is within 150+ / -5 DEG C.

Description

technical field [0001] The invention belongs to the technical field of testing electronic components, in particular to a glass shell diode testing method and equipment. Background technique [0002] The test method for semiconductor discrete devices (GJB128A-97) stipulates in the mechanical performance test series that the axial lead tensile test of the glass shell diode is required to determine the tensile force resistance of the axial lead glass shell diode, that is, when subjected to tensile force Whether there is any discontinuity or open circuit when the positive test is carried out under the condition of temperature control. [0003] During the test, install the diode under test in the tensile test fixture, connect the electrical monitoring equipment with the diode lead wire, the forward current flowing through the diode is 100mA, and record the forward voltage at this time. Then increase the ambient temperature of the diode to 150°C, and when it stabilizes at this te...

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Problems solved by technology

[0012] The object of the present invention is to provide a method and device for tensile testing of axially leaded glass-encapsulated diodes, to solve the problem that in the prior art, when conducting tensile tests on glass-encapsulated diodes, the controllable tensile force and temperature range cannot be satisfied at the same time. The problem

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