Multicore fiber inserting core body for gas tightness packaging of photoswitch

Abstract

The invention relates to a multicore fiber inserting core body for gas tightness packaging of a photoswitch, comprising a plurality of fiber inserting cores; the fiber inserting cores are tubular and radically and tightly arranged, and the axes of the fiber inserting cores are mutually parallel; and adjacent fiber inserting cores are subjected to glass sealing so as to realize fixed connection and seal. The invention can effectively improve the sealing effect and lower the packaging cost, provides a brand new large chamber sealing solution for the packaging of MEMS (Micro-Electro-Mechanical System) photoswitches, and realizes that the inside optical path coupling is adjustable and the omniseal of the photoswitch is realized in the final packaging of an outside light input and output port, thereby improving the reliability of the photoswitch running for a long time.

Description

technical field [0001] The invention belongs to the field of optical communication devices, and in particular relates to a multi-core optical fiber ferrule body used for airtight packaging of optical switches, so as to adapt to the large-room packaging scheme. Background technique [0002] After optical fiber communication realized high-speed, large-capacity point-to-point transmission, it entered the era of optical fiber network at the end of last century. Dense wavelength division multiplexing (DWDM) can make full use of the huge bandwidth of optical fiber. It can be predicted that the goal of establishing an optical Internet is not far away. Due to the sharp increase in the number of multiplexed wavelength channels, the transmission capacity of optical fibers increases exponentially. Correspondingly, the routing and switching of the optical transport network have become the bottleneck of the entire network. [0003] Transmission capacity is relatively easy to expand thr...

AI Technical Summary

Problems solved by technology

The advantage of the 2D structure is that the control is simple, but the disadvantage is that due to the limitation of the optical path and the area of ​​the micromirror, the number of switching ports cannot be made very large

However, since the precision required by the 3D NxN optical switch is very high, and there are MEMS devices and various lens arrays inside, especially the MEMS manufactured by semiconductor technology, because the structure combines electronic control and mechanical motion systems, it has very high requirements for the working environment. High, fine dust may hinder the rotation of the micromirror and fail, the mechanical movement of the MEMS micromirror relies on electrostatic action, and moisture will make the static electricity invalid, and the external corrosive gas will also corrode the surface of the micromirror, reducing the reflectivity This series of problems makes the packaging of optical switches particularly important. The traditional packaging uses adhesive bonding, which will age over time and complex working environment changes, so that the internal parts of the optical switch (such as MEMS) are directly exposed. Gradually fail in the external environment

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