Circular substrate polishing and cleaning device and method

Abstract

The invention relates to a circular substrate polishing and cleaning device and a circular substrate polishing and cleaning method. The device comprises a polishing and cleaning component, a substrate guiding component and a substrate driving component. A substrate is conveyed through the substrate guiding component by a substrate conveyance component, and is guided into the polishing and cleaning component under the rotation of the polishing and cleaning component; the substrate driving component drives the substrate to rotate; a liquid injection component supplies chemical polishing liquid and cleaning liquid to polish and clean the substrate; and after the substrate is polished and cleaned, the rotation direction of the polishing and cleaning component is changed, and the substrate is guided out of the polishing and cleaning component and then is guided into the substrate conveyance component by the substrate guiding component. The device of the invention can be operated and run as an independent mechanism, and also can be used as a module of a large-scale substrate polishing and cleaning system; and single-substrate single-station polishing and cleaning units can be combined into a multi-substrate multi-station system to polish and clean the substrates in batches.

Description

technical field [0001] The present invention relates to the polishing, cleaning device and method of substrate, particularly circular substrate, including circular silicon substrate for producing semiconductor wafer, glass, ceramics and aluminum for producing computer magnetic recording memory (HDD) medium The invention discloses a high-quality circular substrate, a polishing and cleaning device and method for producing optical recording memory discs (CDs), digital versatile discs (DVD) plastic circular substrates, and glass circular substrates for producing optical devices. Background technique [0002] Circular silicon substrates, glass, ceramics, plastic and aluminum circular substrates are widely used in semiconductors, computers, information industries, and civilian products. [0003] In the manufacturing process of semiconductor wafers (Wafer), it is necessary to repeatedly grind and chemical mechanical polishing (CMP, Chemical mechanical polishing) on ​​the substrate,...

AI Technical Summary

Problems solved by technology

Since in the production process of the substrate, the substrate is often repeatedly ground, etched, polished, and cleaned to obtain a substrate with high surface finish and cleanliness, the substrate will be repeatedly transferred from one station to another. A station, or transfer from one device to another, thereby increasing substrate transfer time and reducing productivity

At the same time, due to the possibility of cross-contamination during the transfer process, the cleanliness of the substrate is reduced, so it is difficult to meet the increasingly complex and sophisticated design and production process requirements for the substrate.

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