Solid-state light source assembling device and method

A solid-state light source and assembly device technology, applied in the direction of light source, electric light source, electric light source, etc., can solve the problems of shortened service life, light attenuation, LED and metal plate cannot be tightly bonded, etc., to achieve the best assembly yield, the best Effects of Luminous Properties

Inactive Publication Date: 2010-10-13
FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to obtain a better assembly yield, when assembling the LED on the metal plate, it is necessary to ensure that the mounting surface of the LED (that is, the surface on which the LED is attached to the metal plate) is attached parallel to the bearing surface of the metal plate, otherwise , the assembled LED and the metal plate will not be tightly bonded, so the heat emitted by the LED will be difficult to conduct through the metal plate and dissipate to the outside world, such as the air, resulting in light attenuation and shortened service life

Method used

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  • Solid-state light source assembling device and method
  • Solid-state light source assembling device and method
  • Solid-state light source assembling device and method

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Embodiment Construction

[0015] The embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0016] Please refer to Figure 1 to Figure 3 , a solid-state light source assembling device 100 provided in the first embodiment of the present invention is used for attaching a solid-state light source 20 on a carrier 30 to assemble the solid-state light source 20 and the carrier 30 . The solid-state light source 20 can be an LED chip or an LED, such as figure 1 As shown, in this embodiment, the solid-state light source 20 is an LED chip 20 with a cuboid outline, and the LED chip 20 has a mounting surface 200 and a central axis M, wherein the central axis M is perpendicular to the mounting surface 200 And located on the geometric center of the LED chip. Such as figure 2 As shown, the carrier 30 can be made of metal, which has an arc profile extending along a predetermined direction W as a whole, and includes a mounting surface 32 for c...

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Abstract

The invention relates to a solid-state light source assembling device for attaching at least one solid-state light source on a load bearing frame to assemble the solid-state light source and the load bearing frame. The solid-state light source assembling device comprises a laser transmitter, an assembling unit, a position adjusting unit and a laser sensor. The assembling unit and the position adjusting unit respectively drive the solid-state light source and the load bearing frame so that the solid-state light source is attached on the load bearing frame. The laser transmitter is combined with the laser sensor to sense whether a plane area on the load bearing frame is attached on a preset datum plane and is positioned on the preset normal of the preset datum plane or not, thereby ensuring that the installation surface of the solid-state light source is tightly attached on the plane area of the load bearing frame to assemble and form a light source module. In addition, the invention also relates to a solid-state light source assembling method corresponding to the solid-state light source assembling device.

Description

technical field [0001] The invention relates to a solid-state light source assembling device, in particular to an assembling device for assembling a light emitting diode on a carrier, and an assembling method for assembling the light emitting diode on the carrier. Background technique [0002] Light Emitting Diode (LED, Light Emitting Diode) has the advantages of high brightness, low operating voltage, low power consumption, easy to match with integrated circuits, simple driving, long life, etc. Therefore, it is widely used as an ideal light source in various lighting occasions For details, please refer to the article Thermal Considerations for LED Components in an Automotive Lamp published by Joseph Bielecki et al. on the 2007 IEEE, 23rd IEEE SEMI-THERM Symposium. [0003] The radiation range of a single LED is usually relatively limited. In order to be suitable for occasions that require a larger lighting range, multiple LEDs can be assembled on a metal plate. On the one h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V19/00F21V21/116F21V23/00H05B37/00H05B37/02F21Y101/02
CPCH01L33/00H01L2933/0033
Inventor 赖志铭
Owner FOXSEMICON INTEGRATED TECHNOLOGY (SHANGHAI) INC
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