Chemical mechanical polishing device, polishing method and system for wafer

Abstract

The present invention relates to a chemical mechanical polishing device, and a method and a system of polishing a wafer, wherein the chemical mechanical polishing device for processing the wafer includes a plate for supporting the wafer to be processed in a face-up orientation; a polishing head opposing the plate, wherein the polishing head includes a rotatable polishing pad operable to contact the wafer while the polishing pad is rotating; and a slurry coating system providing a slurry to the polishing pad for polishing the wafer. By means of the invention, it is possible to perform a chemical mechanical polishing process to the face-up wafer; thereby, it is possible to reduce bending degree of the wafer and generate a better whole plainness degree so as to save a process window time of a scanner, it is also possible to reduce chemical reaction time so as to reduce dish-shaped appearance generation or corrosion in micro-shadow treatment. Furthermore, the wafer is faced upwards, such that it is possible to monitor the surface of the in-site wafer simply to implement accurate polishing control so as to be more practical.

Description

technical field [0001] The present invention relates to a semiconductor substrate grinding equipment, in particular to a chemical mechanical polishing (CMP) equipment, a chemical mechanical grinding element capable of performing a face-up wafer chemical mechanical grinding process, a wafer grinding method and a wafer grinding system. Background technique [0002] The semiconductor integrated circuit industry has experienced rapid growth. Technological advances in integrated circuit materials and design have produced generations, each generation having smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing integrated circuits, and to realize these advances, similar developments in integrated circuit processing and manufacturing systems are required. [0003] During the development of integrated circuits, functional density (ie, the number of interconnected elements per wafer area)...

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Problems solved by technology

[0009] This shows that the above-mentioned existing chemical mechanical polishing process obviously still has inconvenience and defects in method and use, and needs to be further improved urgently

In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve

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