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Method and system for fabricating three-dimensional structures with sub-micron and micron features

A sub-micron, three-dimensional technology, applied in the field of transparent first layer, can solve problems such as large-volume and large-area structures that do not provide different types of lattices and are not suitable for micron or sub-micron periodicity

Inactive Publication Date: 2010-12-01
3M INNOVATIVE PROPERTIES CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, conventional fabrication methods are not suitable for fabricating bulky and large-area structures with micron or submicron periodicity
Furthermore, the conventional fabrication methods referenced have not provided the ability to construct different types of lattices with ease of fabrication and control of fabrication defects

Method used

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  • Method and system for fabricating three-dimensional structures with sub-micron and micron features
  • Method and system for fabricating three-dimensional structures with sub-micron and micron features
  • Method and system for fabricating three-dimensional structures with sub-micron and micron features

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Embodiment Construction

[0017] The present invention relates to methods and systems for fabricating micron-scale and sub-micron-scale 3D structures. In a preferred aspect, a stack of polymer layers or organic / inorganic composite or inorganic layers is formed on a substrate, wherein at least one of the layers is continuously embossed and at least one other of the layers is photosensitive. The embossed layer can provide phase mask properties when the stack is moved across the light source. A distribution of radiation intensities for exposing the photosensitive layer is thereby produced. The stack can then be developed, resulting in a 3D structure, and the embossed layer dissolved or delaminated.

[0018] 3D structures produced using the methods and systems described herein can include symmetric or asymmetric patterns of micron or submicron (including nanoscale) features. These patterns of features can have a controllable density that varies with depth. In addition, the 3D structure may also include ...

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Abstract

A method and system are provided for fabricating three-dimensional (3D) structures having micron or submicron features. The method includes providing a continuously-formed relief structured material, the relief structured material having a first layer comprising a material having a pattern of relief structures formed on a first surface thereof. The structured material includes second layer comprising a photosensitive material that is disposed on the first layer. The relief structured material is exposed to radiation through the first layer, where the pattern of relief structures formed on the first surface of the first layer generates a 3-dimensional light intensity pattern of the radiation that is incident on the second layer. The exposed material is developed, where the developed material comprises a plurality of 3D structures having micron or submicron features.

Description

Background technique [0001] The present invention generally relates to manufacturing systems and methods. More particularly, the present invention relates to methods and systems for fabricating micron-scale and sub-micron-scale three-dimensional (3D) structures in a continuous manner. [0002] Demand for new products with more features in a smaller area has led to an increasing need to manufacture smaller features at higher yields. Some are used to fabricate three-dimensional periodic structures (also known as "3D periodic structures", or more specifically "3D periodic nanostructures", where such structures have length, width and height characteristics in the nanoscale system) conventional techniques are known. By "3D structure" is meant a structure that may be quasi-periodic in all three dimensions (length, width and height). These conventional methods include techniques based on colloidal precipitation, polymer phase separation, templated growth, fluidic self-assembly, mu...

Claims

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Application Information

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IPC IPC(8): H01L21/027
CPCG03F7/2035G03F1/14G03F1/34G03B27/52G03F7/20
Inventor 杰罗姆·C·波尔凯
Owner 3M INNOVATIVE PROPERTIES CO
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