Placing table apparatus, processing apparatus and temperature control method

Abstract

A placing table apparatus is provided with a placing table (26) for placing a body (W) to be processed on an upper surface; a heating mechanism (30) having a plurality of heater sections respectively arranged in a plurality of heating zones concentrically divided on the placing table (26); a leg section (28), which is connected to the center portion of the placing table (26) and horizontally supports the placing table in an upright state; temperature measuring sections (38), which are arranged corresponding to the heating zone on the innermost circumference in the heating zones; and a power supply control section (42), which controls the temperature of the heater section on the innermost circumference through feedback, based on a measurement value obtained from the temperature measuring sections (38), and controls power supply to other heater sections, at a safe power supply rate for the heater section on the innermost circumference. The safe power supply rate is determined so that a temperature difference between the heater sections on the innermost circumference is within a range where a placing table (26) does not break.

Description

technical field [0001] The present invention relates to a processing device for performing heat treatment such as film formation processing on a target object such as a semiconductor wafer, a stage device and a temperature control method used in the processing device. Background technique [0002] In order to manufacture a semiconductor integrated circuit, various processes such as film formation, etching, thermal diffusion, and modification are generally repeated on a target object such as a semiconductor wafer. [0003] For example, a single-sheet processing device that performs heat treatment on each semiconductor wafer is described as an example. In a processing container that can be evacuated, for example, a mounting table equipped with a resistance heater made of molybdenum wire is installed on the The upper ends of the legs stand up from the bottom of the container, and a semiconductor wafer is placed on this stage. Then, with the semiconductor wafer placed on the mo...

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Problems solved by technology

[0007] However, as mentioned above, the mounting table and the legs supporting the mounting table are made of ceramic materials such as AlN (aluminum nitride), but this ceramic material is a brittle material, so the temperature distribution between the inner and outer circumferences of the mounting table may be the cause. The thermal stress generated is easy to damage the mounting table

In particular, in the method of controlling the temperature of the heating region (heater) on the inner and outer periphery of the stage by using the current ratio and the voltage ratio depending on the process temperature, there is a problem that the ceramic stage is easily damaged.

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