Conductive printing ink composite for printing of wireless radio frequency identification devices (RFID)

[0029] Example 1: Weigh the epoxy resin, epoxy toughness modifier, adhesion promoter, rheology control agent according to the mass given in Table 2 and mix them. The mixing method is mechanical stirring, the stirring speed is 1000 rpm, and the time is 10 minutes. Then, the weighed mixed filler of silver nanowire and silver nanoparticle, filler surface modifier, and diluent are sequentially added to the mixture under stirring. After the addition, stirring was continued for 10 minutes. After mixing uniformly, add curing agent and curing accelerator to the mixture. After mechanical stirring for 5 minutes, transfer the mixture to a high-speed shear mixer for mixing. The mixing speed is 2000 rpm and the time is 30 seconds. Repeat the mixing process in the high-speed shear mixer 3 times to obtain a uniformly mixed gel that is the conductive ink.

[0030] The preparation of the test sample for the bonding strength of the conductive ink is carried out in accordance with the standard ASTM1002-01. First, the copper substrate used for the test is wiped with ethyl acetate to remove the oil, and then the glue is applied to the surface to be bonded, and the two pieces of copper The sheet is closed, fixed with a metal clip, and then placed in a curing oven. The curing condition is 120 degrees for 30 minutes. After the solidified sample is cooled, it is tested on a tensile testing machine to obtain specific data of the bond strength. The conductivity test of the conductive ink is carried out in accordance with the standard GBT12966-91. The preparation of the sample is to coat the ink on a glass plate with a length of 50mm and a width of 20mm. After the ink is leveled and cured, it is placed in a curing oven for curing. The curing conditions are 120 degrees for 30 minutes. After the solidified sample is cooled to room temperature, the surface resistance test is performed with a four-digit resistance meter.

[0031] The bonding strength, surface resistivity and surface resistance stability test results of the silver nanowire-filled conductive ink prepared according to Example 1 are listed in Table 1. It can be seen from the data in the table that the average surface resistivity of conductive ink reaches 10 -4 Ωcm, the bonding strength of the copper plate at room temperature reaches 13MPa, and the surface resistivity does not change more than 15% after 500 hours of aging treatment at 80°C and 80% humidity.

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[0034] Examples 2-11

[0035] According to the ingredients and dosage listed in Table 2, weigh the epoxy resin, epoxy toughness modifier, adhesion promoter, rheology control agent, etc. and mix them. The mixing method is mechanical stirring, the stirring speed is 1000 rpm, and the time is 10 minutes. Then, the weighed conductive filler, filler surface modifier, and diluent are sequentially added to the mixture under stirring. After the addition, stirring was continued for 10 minutes. After the mixing is uniform, the curing agent and curing accelerator are added to the mixture, and the mixture is transferred to a high-speed shear mixer for mixing after mechanical stirring for 5 minutes. The mixing rate is 2000 rpm and the time is 30 seconds. Repeat the mixing process in the high-speed shear mixer 3 times to obtain a uniformly mixed jelly that is the conductive ink composition.

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