Method and device for preparing low melting point solder balls
A technology with low melting point and solder balls, which is applied in the field of preparation of low melting point spherical microparticles, can solve problems such as inability to achieve consistent particle size and unguaranteed precision, and achieve the effects of continuity and stability, improved production efficiency, and uniform tissue composition
Inactive Publication Date: 2012-11-21
DALIAN UNIV OF TECH
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Problems solved by technology
It is known that Yan Yanfu, Zhang Xiangmin, Zhang Keke, Wen Jiuba, Yang Dixin, Chen Fuxiao, Lu Yongmin, Chen Huimin, and Liu Chongxi invented "a processing equipment for brazing balls used in vibratory spraying high-seal packaging" with the application number CN200510130406.2 and process method” patent, the purpose is to develop a vibratory spraying equipment to prepare brazing balls for high-seal packaging, but this patent does not involve piezoelectric ceramics, the accuracy cannot be guaranteed, and the particle size cannot be consistent
Among the known invention patents, there is no method for preparing uniform solder balls with low melting point by using the pulsed hole spraying method
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[0020] specific implementation plan
[0021] The specific implementation of this solution will be described in detail below in conjunction with the technical solution and accompanying drawings.
[0022] The working principle of the present invention is to heat the low-melting point material to a molten state through a heater under the condition that the inert gas Ar gas is introduced to generate a back pressure, and then use piezoelectric ceramics to generate a downward displacement under the excitation of a pulse drive signal. And it is transferred to the molten liquid by the transmission rod and the pressing plate, so that a certain amount of tiny liquid is injected through the small hole in the lower part of the crucible, and the injected liquid solidifies without a container to form a uniform solder ball during the falling process.
[0023] The material of the crucible 11 with the central hole and the central hole 12 used in this embodiment must have low wettability with t...
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The invention discloses a method and a device for preparing low melting point solder balls, belongs to the technical field of low melting point microparticle preparation, and in particular relates to a method for preparing the low melting point solder balls by utilizing micropore jet. The method comprises the following steps of: under the condition that inert gas Ar is introduced to generate backpressure, heating low melting point materials into a melting state by using a heater; generating downward displacement under the excitation of pulse driving signals by utilizing piezoelectric ceramics, and transmitting to melted liquid by using a transmission rod and a pressure sheet to ensure that a certain amount of micro liquid is jetted through micropores on the lower part of a crucible and the jetted liquid forms uniform solder balls in the falling process under containerless solidification. The device consists of a jet part component on the upper part and a recycling room component on the lower part. The solder balls prepared by the method have the advantages of consistent size, uniform texture and components, controllable particle size, high sphericity, suitability for various materials with proper melting points, and capacities of meeting the requirements of continuity, stability and high efficiency production of production and meeting the requirement of the modern microelectronic packaging industry.
Description
technical field [0001] The invention belongs to the technical field of preparation of low-melting point spherical microparticles, in particular to a method for preparing low-melting point solder balls by spraying through small holes. Background technique [0002] For solder balls made of low melting point materials, the most widely used ones are solder ball particles used in the field of electronic packaging. In recent years, with the development of electronic devices in the direction of miniaturization and integration, higher requirements have been put forward for the precision and multi-field of the microelectronic packaging industry. Multi-component high-precision solder balls have become an important part of modern microelectronic packaging Therefore, the requirements for the composition and precision of solder balls are becoming increasingly stringent. At present, most of the solder balls used by my country's microelectronic packaging factories are imported from abroad...
Claims
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IPC IPC(8): B22F9/08
Inventor 董伟谭毅李颖
Owner DALIAN UNIV OF TECH