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Method for determining optimal curing condition of thermosetting resin

A curing condition, thermosetting technology, used in color/spectral property measurement, measuring device, material analysis by optical means, etc., can solve problems such as poor mechanical properties, and achieve the effect of simplified method, fast analysis speed, and complete system

Inactive Publication Date: 2011-01-05
NANJING FORESTRY UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The molecular structure of thermosetting resin is body shape, including most condensation resins. The advantage of thermosetting resin is high heat resistance and not easy to deform under pressure; the disadvantage is poor mechanical properties

Method used

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  • Method for determining optimal curing condition of thermosetting resin
  • Method for determining optimal curing condition of thermosetting resin
  • Method for determining optimal curing condition of thermosetting resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Embodiment 1: a kind of method for determining the optimum curing condition of thermosetting resin obtains according to the following method:

[0052] ① Preliminary determination of the amount of A and B added

[0053] According to the actual situation, the ratio A / B=3:1 of the two components with ideal drying conditions is preliminarily selected.

[0054] ②Consolidation process, determine the best curing temperature

[0055]Install the potassium bromide (KBr) window where the sample is placed in the "accessory", and then place the "accessory" as a whole in the optical path of the infrared spectrum sample chamber; adjust the temperature control device to raise the temperature of the inner cavity of the "accessory" to the set value Temperature; according to the mass ratio A / B=3:1, accurately weigh components A and B with an electronic balance, mix immediately, and stir evenly; take an appropriate amount of mixed resin, and apply it to the potassium bromide (KBr) in the ...

Embodiment 2

[0060] Embodiment 2: The mass ratio of components A and B of the polyurethane sample is set to be 2:1, and the rest are the same as in Embodiment 1.

Embodiment 3

[0061] Embodiment 3: The mass ratio of components A and B of the polyurethane sample is set to be 4:1, and the rest are the same as in Embodiment 1.

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Abstract

The invention relates to a novel method for determining the optimal curing condition of unknown bicomponent thermosetting resin. Taking polyurethane resin as an example, the method is mainly realized through the following three steps of: preliminarily determining a proportion, curing at different fixed temperatures and curing at different heating rates. The method comprises the following concrete means of: obtaining a conversion rate curve for reflecting the curing degree of the thermosetting resin by utilizing an infrared spectrum variable-temperature accessory and monitoring the change of the transmittance of a characteristic functional group; and finally, obtaining the optimal curing condition through the integrative comparison of the conversion rate curve. The method has the advantages of complete system and strong operability, is applicable to bicomponent thermosetting resin in other types and has extensive application prospect in productive practice.

Description

technical field [0001] The invention belongs to the field of macromolecular materials and coatings, and relates to a new method for determining the best curing conditions of unknown two-component thermosetting resins through infrared spectroscopy. Background technique [0002] Thermosetting resins refer to a large class of synthetic resins that undergo chemical reactions under heating, pressure, or under the action of curing agents and ultraviolet light, and cross-link and solidify into insoluble and infusible substances. The molecular structure of thermosetting resin is body shape, including most condensation resins. The advantage of thermosetting resin is high heat resistance and not easy to deform under pressure; the disadvantage is poor mechanical properties. [0003] Commonly used thermosetting resins include phenolic resin, urea-formaldehyde resin, melamine-formaldehyde resin, epoxy resin, unsaturated resin, polyurethane, polyimide, etc. Thermosetting resins are mainl...

Claims

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Application Information

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IPC IPC(8): G01N21/35G01N21/3577
Inventor 郭斌银鹏朱亦希薛岚徐杰
Owner NANJING FORESTRY UNIV
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