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Shell structure

A housing structure and body technology, which is applied to electric solid state devices, semiconductor devices, semiconductor/solid state device components, etc., can solve problems such as reduced operating efficiency, burnout, short circuit, etc., to reduce temperature, improve operating efficiency, and avoid burnout Effect

Inactive Publication Date: 2011-01-26
INVENTEC CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a shell structure, so that improving the shell structure used in general electronic devices cannot improve the heat dissipation efficiency of the plug-in electronic components, so that the plug-in electronic components are prone to failure due to excessive operating temperature. Problems that lead to reduced operating performance, short circuit, and burnout

Method used

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Embodiment Construction

[0047] Such as figure 1 As shown, the shell structure disclosed in the embodiment of the present invention is applied to portable electronic devices 10, such as notebook computers, personal digital assistants, mobile phones and handheld game machines, etc., for setting a circuit board 20, and aligning the circuit board At least one electronic component on the 20 is used for heat dissipation. The electronic component is a fixed electronic component 22 fixed on the circuit board 20, such as a chipset (chipset) and a central processing unit, etc., or a plug that can be plugged or unplugged from the circuit board 20 according to user needs. Plug-in electronic components 24, such as plug-in memory and peripheral controller adapter card (PCI card). There are a plurality of chipsets 242 on the plug-in electronic assembly 24, and the plug-in electronic assembly 24 is inserted in the electrical connection hole 262 of the slot 26 of the circuit board 20 (such as image 3 shown) to for...

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PUM

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Abstract

The invention discloses a shell structure provided with a circuit board. The circuit board is provided with at least one electronic assembly, and a gap is positioned between one side surface of the electronic assembly and the circuit board. The shell structure comprises a body and a heat radiating plate, wherein the circuit board is arranged on the body; the heat radiating plate is arranged between the body and the circuit board and provided with at least one heat conducting part; and the heat conducting part is positioned in the gap and in contact with the side surface of the electronic assembly. The invention can solve the problems that a plug type electronic assembly is easy to cause reduced operation efficiency, short circuit and overburning due to excess working temperature because the shell structure used for a general electronic device can not enhance the heat radiating efficiency of the plug type electronic assembly.

Description

technical field [0001] The invention relates to a casing structure, in particular to a casing structure with heat dissipation function. Background technique [0002] With the rapid improvement of electronic technology, the design of various electronic devices is moving towards the goal of being light, thin, short, and small. However, due to the substantial reduction in the volume of such products, various electronic components are derived. For portable electronic devices such as notebook computers, personal digital assistants (PDAs), and handheld game consoles, the problem of high heat emission is mostly solved by installing a cooling fan inside the casing to solve heat sources (such as chips, chips, etc.) The problem of overheating of electronic components such as central processing unit and integrated circuit), however, for ultra-thin computers, portable mobile computers or simple computers, because of the limited internal space available, it is easy to use in this type of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/00H05K7/20H01L23/34
Inventor 王锋谷杨智凯
Owner INVENTEC CORP