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Microchip and method of manufacturing same

A manufacturing method and microchip technology, applied in separation methods, chemical instruments and methods, manufacturing microstructure devices, etc., can solve problems such as difficulty in forming a uniform flow path, and achieve suppression of stagnation, reduction of reproducibility, and suppression of liquid levels highly uneven effect

Active Publication Date: 2011-01-26
FUJIFILM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when forming a flow path by joining a flat plate-shaped sealing member, it is difficult to form a uniform flow path if the shapes of the base material and the sealing member are slightly deformed or warped. This may be a problem for microanalysis chips that require high precision

Method used

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  • Microchip and method of manufacturing same
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  • Microchip and method of manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0124] Bonding of resin substrate 10 and resin film 20 and thermal annealing

[0125] First, Embodiment 1 will be described. Polymethyl methacrylate and other acrylic resins (manufactured by Asahi Kasei, Delpetto 7 O N H) were molded with an injection molding machine, and a plurality of streams with a width of 50 μm and a depth of 50 μm were produced on a plate-shaped member with an external dimension of 50 mm × 50 mm × 1 mm. The resin substrate 10 is composed of a channel groove 11 and a plurality of through holes 15 having an inner diameter of 2 mm.

[0126] As the resin film 20 , an acrylic resin such as polymethyl methacrylate (manufactured by Mitsubishi Rayon, with a thickness of 75 μm) was cut into a size of 50 mm×50 mm. Then, the resin film 20 is bonded to the bonding surface 12 of the resin substrate 10 with the groove 11 for the flow path, and the press temperature is 90° C. and 10 kgf / cm by a hot press machine. 2 The resin substrate 10 and the resin film 20 are bonde...

Embodiment 2

[0130] Bonding of resin substrate 10 and resin film 20 and thermal annealing

[0131] Example 2 will be described below. Acrylic resin (manufactured by Asahi Kasei, Delpetto 7 O N H) such as transparent resin material polymethyl methacrylate was molded with an injection molding machine, and a 50 μm wide and 50 μm deep plate was produced on a plate-shaped part with an external dimension of 50 mm × 50 mm × 1 mm. A resin substrate 10 composed of a plurality of channel grooves 11 and a plurality of through holes 15 having an inner diameter of 2 mm.

[0132] As the resin film 20 , an acrylic resin such as polymethyl methacrylate (made by Mitsubishi Rayon, manufactured by Mitsubishi Rayon, with a thickness of 75 μm) was cut into 50 mm×50 mm. Then, the resin film 20 is bonded to the bonding surface 12 of the resin substrate 10 with the groove 11 for the flow path, and the press temperature is 90° C. and 10 kgf / cm by a hot press machine. 2 The resin substrate 10 and the resin film 2...

Embodiment 3

[0136] Bonding of resin substrate 10 and resin film 20 and thermal annealing

[0137] Example 3 will be described below. Acrylic resin (manufactured by Asahi Kasei, Delpetto 7 O N H) such as transparent resin material polymethyl methacrylate was molded with an injection molding machine, and a 50 μm wide and 50 μm deep plate was produced on a plate-shaped part with an external dimension of 50 mm × 50 mm × 1 mm. A resin substrate 10 composed of a plurality of channel grooves 11 and a plurality of through holes 15 having an inner diameter of 2 mm.

[0138] As the resin film 20 , an acrylic resin such as polymethyl methacrylate (made by Mitsubishi Rayon, manufactured by Mitsubishi Rayon, with a thickness of 75 μm) was cut into 50 mm×50 mm. Then, the resin film 20 is bonded to the bonding surface 12 of the resin substrate 10 with the groove 11 for the flow path, and the press temperature is 90° C. and 10 kgf / cm by a hot press machine. 2 The resin substrate 10 and the resin film 2...

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Abstract

Provided are a microchip enabling accurate analysis by preventing a resin film from being deflected into a flow path groove to eliminate the stagnation of a liquid sample; and a method of manufacturing the microchip. This microchip includes a flow path that is formed by joining a resin film onto the groove-formed surface of a resin substrate. The deflection angle of the resin film in the sectional surface of the flow path in the width direction is made to be 0 to less than 30 DEG at respective positions of the flow path.

Description

technical field [0001] The present invention relates to a microchip having a flow path and a manufacturing method thereof. Background technique [0002] Using microfabrication technology to form fine flow channel grooves on silicon and glass substrates, and to form flow channels and circuits by bonding flat plate-shaped sealing members to the substrates, thereby performing liquid samples such as nucleic acid, protein, and blood in a small space. Micro analysis chips for chemical reaction, separation, analysis, etc., or devices called μTAS (Micro Total Analysis Systems) have been put into practical use. Such a microchip is advantageous in that it can reduce the amount of samples and reagents used or the amount of waste liquid discharged, and realizes a space-saving and portable low-cost system. [0003] In addition, in order to reduce the manufacturing cost, it has been considered to manufacture the micro-analysis chip substrate and the sealing member using a resin. [0004...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N35/08B81B1/00G01N37/00
CPCB01L2300/0816B81B2203/0338B01L2200/0689B81C1/00103B01L3/502707B01L3/502746B81B2201/058B81B2203/0384B81C2201/019B01L2300/0887Y10T156/1062Y10T428/24562Y10T428/24331
Inventor 平山博士
Owner FUJIFILM CORP