Phenolic foam insulation board for high-strength walls and manufacturing method thereof

Abstract

The invention relates to a phenolic foam insulation board for high-strength walls and a manufacturing method thereof. The phenolic foam insulation board comprises the following raw materials in part by weight: 100 parts of modified phenolic resin, 2 to 10 parts of surfactant, 2 to 20 parts of foaming agent, 6 to 30 parts of curing agent, and 1 to 20 parts of regulator. The manufacturing method comprises the following steps of: preparing the raw materials according to the proportion; uniformly stirring according to the proportion, and uniformly arranging on the surface of a nonwoven fabric; forming in a laminating machine at the temperature of between 40 and 80 DEG C for 3 to 30 minutes; and finally trimming and cutting. The manufacturing method has the advantages of one-time forming and simple processing technology, and the manufactured insulation board has the advantages of stable quality, high board strength and no defects such as easy breakage and chip falling of the board surface.

Description

technical field [0001] The invention relates to a foam insulation board, in particular to a phenolic foam insulation board for high-strength walls and a manufacturing method thereof. Background technique [0002] The phenolic foam insulation panels used in the market at this stage are difficult to meet the requirements of wall insulation due to their low strength. Moreover, the manufacturing process is complex, labor-intensive, unstable in quality, and the surface of the board is fragile and slag-dropped. [0003] Looking further, even if the existing large block of phenolic foam on the market is used for manufacturing, the thin plates cut into various specifications also have the following defects: First, due to the large volume of the foam, it is affected by Due to the influence of gravity and other factors, the density of the foam body is inconsistent from top to bottom, inside and outside, and the density and strength of the cut and formed boards are quite different. I...

AI Technical Summary

Problems solved by technology

[0002] At this stage, the phenolic foam insulation boards used in the market are difficult to meet the requirements of wall insulation due to their low strength.

Moreover, the manufacturing process is complicated, labor-intensive, unstable in quality, fragile on the surface of the board, and slag falls

[0003] Looking further, even if the existing large pieces of phenolic foam on the market are used to manufacture, the thin plates cut into various specifications also have the following defects: First, due to the large volume of the foam, it is subjected to pressure during the foaming process. Due to the influence of gravity and other factors, the density of the foam body is inconsistent between the top and bottom, inside and outside, and the density of the cut and formed boards is quite different, and the strength is different; It is achieved by increasing the amount of acid, resulting in a low pH value of the forming foam and excessive acid residue; third, when cutting the sheet, the foam surface structure on the cutting surface is destroyed, and the cutting surface is dusted and bonded with other materials At the same time, the strength of the knot is unstable, and it is difficult to compound with other materials; besides, the existing technology used in the phenolic foam sandwich panel adopts the process of continuous foaming composite color steel plate, although the cutting process is omitted, the dust on the surface of the plate is avoided. , there is also too much acid residue, which directly affects the service life of the composite material